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  • IPC 9501 : 0

    Current The latest, up-to-date edition.

    PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)

    Available format(s):  Hardcopy

    Language(s):  English

    Published date:  01-07-1995

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1.0 SCOPE
    2.0 APPLICABLE DOCUMENTS
    2.1 Institute for Interconnecting and Packaging
         Electronic Circuits (IPC)
    2.2 Joint Industry Standards
    2.3 Electronic Industries Association
    2.4 Military
    3.0 TERMS AND DEFINITIONS
    4.0 APPLICATIONS AND OBJECTIVES
    5.0 APPARATUS
    6.0 REQUIREMENTS
    7.0 RECOMMENDATIONS
    8.0 COMPONENT CLASSIFICATION
    9.0 COMPONENT PROCESS PRECONDITIONING PROCEDURES
    9.1 Moisture Preconditioning
    9.2 Component Mounting
    9.3 First Soldering Process Exposure
    9.4 Aliphatic or Terpene Hydrocarbon Cleaning
    9.5 Second Soldering Process Exposure
    9.6 Water Soluble Flux Exposure
    9.7 Third Soldering Process Exposure
    9.8 Aqueous Detergent/DI Water Total Immersion Cleaning
    10.1 Moisture Exposure
    10.2 Component Mounting
    10.3 Soldering Process Exposure
    10.4 Chemical Exposure
    10.5 Criteria
    11.0 SOLDERING PROCESS COMPATIBILITY MATRIX

    Abstract - (Show below) - (Hide below)

    Specifies manufacturing process simulations for use with applicable component specifications to assure that electronic components can meet expected reliability requirements after exposure to assembly factory processes.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 9702 : 0 MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS
    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IPC 9500 : 2003 ASSEMBLY PROCESS COMPONENT SIMULATIONS, GUIDELINES & CLASSIFICATIONS PACKAGE
    IPC 9504 : 0 ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS)
    IPC 9502 : 0 PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS
    IPC SM 786 : A1995 PROCEDURES FOR CHARACTERIZING AND HANDLING OF MOISTURE/REFLOW SENSITIVE ICs
    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    IPC 9702 CHINESE : - MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS
    IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
    IPC M 109 : LATEST COMPONENTS HANDLING MANUAL
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IPC 9701 CHINESE : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC 9503 : 0 MOISTURE SENSITIVITY CLASSIFICATION FOR NON-IC COMPONENTS
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC M 109 : LATEST COMPONENTS HANDLING MANUAL
    IPC HDBK 001 : E HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001
    IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    IPC 9504 : 0 ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS)
    IPC 9502 : 0 PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS
    IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
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