BS EN 62137-1-2:2007
Current
The latest, up-to-date edition.
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
Hardcopy , PDF
English
31-10-2007
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
5.1 Shear test equipment
5.2 Pushing tool
5.3 Optical microscope
5.4 Scanning electron microscope (SEM)
5.5 Reflow soldering oven
5.6 Test substrate
5.7 Solder alloy
5.8 Solder paste
6 Mounting method
7 Test conditions
7.1 Test: Rapid change of temperature
7.2 Shear strength test
8 Test procedure
8.1 Test sequence
8.2 Pre-conditioning
8.3 Initial shear strength
8.4 Rapid change of temperature
8.5 Recovery
8.6 Intermediate/final shear strength
9 Items to be included in the test report
10 Items to be given in the product specification
Annex A (normative) - Shear strength test - Details
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding
European publications
Applies to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 05/30133599 DC. (10/2007)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.
| Standards | Relationship |
| EN 61340-3-1:2002 | Identical |
| NBN EN 62137-1-2 : 2007 | Identical |
| EN 62137-1-2:2007 | Identical |
| NF EN 62137-1-2 : 2014 | Identical |
| IEC 62137-1-2:2007 | Identical |
| DIN EN 62137-1-2:2008-02 | Identical |
| I.S. EN 62137-1-2:2007 | Identical |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| EN 61249-2-7:2002/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
| EN 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61188-5-5:2007 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.