BS EN 62572-3:2016
Current
The latest, up-to-date edition.
Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication
Hardcopy , PDF
English
30-06-2016
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions, symbols
and abbreviations
4 Laser reliability and quality assurance
procedure
5 Tests
6 Activities
Annex A (informative) - Guidance on testing
in Table 1 and Table 2
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Specifies reliability assessment of laser modules used for telecommunication.
| Committee |
GEL/86/3
|
| DevelopmentNote |
Supersedes 09/30183239 DC. (03/2012) Supersedes 13/30277892 DC. (08/2014) Supersedes 15/30323391 DC. (06/2016)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of IEC 62572 deals with reliability assessment of laser modules used for telecommunication.
The aim of this standard is
to establish a standard method of assessing the reliability of laser modules in order to minimize risks and to promote product development and reliability;
to establish means by which the distribution of failures with time can be determined. This should enable the determination of equipment failure rates for specified end of life criteria.
In addition, guidance is given in IEC TR 62572-2.
| Standards | Relationship |
| IEC 62572-3:2016 | Identical |
| EN 62572-3:2016 | Identical |
| IEC 60749-8:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| IEC 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
| EN 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60749-11:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method |
| EN 60749-11:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method |
| IEC 60749-26:2013 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| EN 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
| IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
| EN 60749-8:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing |
| IEC 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
| EN 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
| EN 60749-26:2014 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
| IEC TR 62572-2:2008 | Fibre optic active components and devices - Reliability standards - Part 2: Laser module degradation |
| EN 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| EN 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 60749-12:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
| EN 60749-12:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
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