BS QC 763000(1990) : AMD 6754

National foreword
Committees responsible
Section 1 - Scope, object and classification
1.1 Scope
1.2 Object
1.3 Technological classification of F and HFICs
Section 2 - General
2.1 Order of precedence
2.2 Related documents
2.3 Units and symbols
2.4 Terminology
2.5 Standard and preferred values
2.6 Marking
Section 3 - Quality assessment procedures
3.1 Primary stage of manufacture
3.2 Manufacturing stages and sub-contracting
3.3 Manufacturer approval
3.4 Approval of film integrated circuits and hybrid
      film integrated circuits
3.5 Qualification approval
3.6 Capability approval
3.7 Certified records of released lots
3.8 Delayed deliveries
3.9 Delivery of F and HFICs subjected to destructive
      or non-destructive tests
3.10 Supplementary procedure for deliveries
3.11 Supplementary information
Section 4 - Test and measurement procedures
4.1 General
4.2 Standard conditions for testing
4.3 Visual examination
4.4 Electrical measurement procedures
4.5 Environmental testing procedures

This generic specification is applicable to film integrated circuits and to hybrid film integrated circuits, both passive and active, as in IEC Publication 748-1, Chapter IV, Sub-clause 2.4. Applies to partly-completed F and HFICs supplied to customers for subsequent processing. Also applies to chip carrier circuits having more than one chip, provided that they, as separate products, have been interconnected by film interconnection techniques. Not intended to cover printed circuit boards but is applicable to F and HFICs which may include them.