CEI EN 60068-2-83 : 2012
Current
The latest, up-to-date edition.
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
Hardcopy , PDF
English
01-01-2012
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FOREWORD
INTRODUCTION
1. Scope
2. Normative references
3. Terms and definitions
4. Test
5. Preconditioning
6. Preparation
7. Quick heating method
8. Synchronous method
9. Temperature profile method
Annex A (normative) - Equipment for the quick
heating and synchronous method
Annex B (informative) - Reading of the output
data and correction of the result
in the quick heating test
Annex C (normative) - Test equipment for the
temperature profile method
Annex D (informative) - Reading of the output
data and correction of the result
in the temperature profile test
Annex E (informative) - Caveats/Notes
Bibliography
Annex ZA (normative) - Normative references
to international publications
with their corresponding
European publications
Describes the methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 104-46. (11/2012)
|
| DocumentType |
Standard
|
| Pages |
44
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 60068-2-83 : 2011 | Identical |
| IEC 60068-2-83:2011 | Identical |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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