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CENELEC
EN 60068-2-69:2017/AC:2018-03

EN 60068-2-69:2017/AC:2018-03

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ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018)

Published date

09-03-2018

Publisher

European Committee for Standards - Electrical

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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the method
5 Description of the test apparatus
6 Preparation of specimens
7 Materials
8 Procedure
9 Presentation of results
10 Information to be given in the relevant specification
Annex A (normative) - Equipment specification
Annex B (informative) - Use of the wetting balance for
        SMD solderability testing
Annex C (normative) - Test methods for SMD components
        sizes 0603M (0201) or smaller
Annex D (informative) - Evaluation criteria - Guidance
Annex E (informative) - Method of calculating the maximum
        theoretical force and integrated value of the area of the
        wetting curve for leaded non-SMD
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Defines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.

Committee
SR 91
DevelopmentNote
Supersedes EN 60068-2-54. (06/2017)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current
Supersedes

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IEC 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
ISO 9453:2014 Soft solder alloys Chemical compositions and forms
EN 60068-2-66:1994 Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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