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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Amendment of: EN 60749-19:2003
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Published date: 03-09-2010
Publisher: European Committee for Standards - Electrical
Foreword1 Scope2 Description of the test apparatus3 Test method4 Failure criteria5 Requirements6 Categories of separation7 Summary
Describes the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term "semiconductor die" should be taken to include passive elements).
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