EN 62047-3 : 2006
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
20-09-2006
FOREWORD
1 Scope
2 Normative references
3 Test piece materials
4 Test piece fabrications
5 Plane shape of test piece
6 Test piece thickness
7 Gauge mark
8 Test
9 Document attached to standard test pieces
Annex A (informative) Test piece
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10[mu]m, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices.
| Committee |
SR 47
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| NEN EN IEC 62047-3 : 2006 | Identical |
| UNE-EN 62047-3:2006 | Identical |
| IEC 62047-3:2006 | Identical |
| PN EN 62047-3 : 2006 | Identical |
| BS EN 62047-3:2006 | Identical |
| NBN EN 62047-3 : 2007 | Identical |
| I.S. EN 62047-3:2006 | Identical |
| NF EN 62047-3 : 2006 | Identical |
| DIN EN 62047-3:2007-02 | Identical |
| CEI EN 62047-3 : 2007 | Identical |
| PNE-prEN 62047-3 | Identical |
| I.S. EN 62047-22:2014 | SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 22: ELECTROMECHANICAL TENSILE TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES |
| EN 62047-12 : 2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES (IEC 62047-12:2011) |
| EN 62047-11 : 2013 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR COEFFICIENTS OF LINEAR THERMAL EXPANSION OF FREE-STANDING MATERIALS FOR MICRO-ELECTROMECHANICAL SYSTEMS (IEC 62047-11:2013) |
| BS EN 62047-22:2014 | Semiconductor devices. Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates |
| CEI EN 62047-12 : 2012 | SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES |
| CEI EN 62047-11 : 2014 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR COEFFICIENTS OF LINEAR THERMAL EXPANSION OF FREE-STANDING MATERIALS FOR MICRO-ELECTROMECHANICAL SYSTEMS |
| BS EN 62047-11:2013 | Semiconductor devices. Micro-electromechanical devices Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems |
| I.S. EN 62047-11:2013 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR COEFFICIENTS OF LINEAR THERMAL EXPANSION OF FREE-STANDING MATERIALS FOR MICRO-ELECTROMECHANICAL SYSTEMS (IEC 62047-11:2013 (EQV)) |
| BS EN 62047-12:2011 | Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures |
| BS EN 62047-8:2011 | Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films |
| EN 62047-22:2014 | Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates |
| I.S. EN 62047-12:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES (IEC 62047-12:2011) |
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
| EN 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
| ISO 17561:2016 | Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for elastic moduli of monolithic ceramics at room temperature by sonic resonance |
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