EN 62435-2:2017
Current
The latest, up-to-date edition.
Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
28-04-2017
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Principles of deterioration
5 Technical validation of the components
Annex A (normative) - Failure mechanisms - Encapsulated and
non-encapsulated active components
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
IEC62435-2:2017 is related to deterioration mechanisms and is concerned with the way that components degrade over time depending on the storage conditions applied. This part also includes guidance on test methods that may be used to assess generic deterioration mechanisms. Typically, this part is used in conjunction with IEC 62435-1:2017 for any device long-term storage whose duration may be more than 12 months for product scheduled for long duration storage.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 62435-2 : 2017 | Identical |
| NF EN 62435-2 : 2017 | Identical |
| BS EN 62435-2:2017 | Identical |
| UNE-EN 62435-2:2017 | Identical |
| I.S. EN 62435-2:2017 | Identical |
| CEI EN 62435-2 : 1ED 2017 | Identical |
| PN EN 62435-2 : 2017 | Identical |
| NEN EN IEC 62435-2 : 2017 | Identical |
| IEC 62435-2:2017 | Identical |
| SN EN 62435-2 : 2017 | Identical |
| VDE 0884-135-2 : 2017 | Identical |
| DIN EN 62435-2 : 2013 | Identical |
| PNE-FprEN 62435-2 | Identical |
| EN 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| I.S. EN 62435-5:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
| BS EN 62435-5:2017 | Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
| CEI EN 62435-5 : 1ED 2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
| IEC 60749-21:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| EN 60749-20-1 : 2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| IEC 61760-4:2015 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
| IEC TR 61340-5-2:2007 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
| IEC TR 62380:2004 | Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| IEC TS 61945:2000 | Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| IEC TR 62258-3:2010 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| IEC 60721-3-3:1994+AMD1:1995+AMD2:1996 CSV | Classification of environmental conditions - Part 3-3: Classification of groups of environmental parameters and their severities - Stationary use at weatherprotected locations |
| IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| IEC 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| IEC 60721-3-1:1997 | Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage |
| EN 190000:1995 | Generic Specification: Monolithic integrated circuits |
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