I.S. EN 62258-1:2010
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
Hardcopy , PDF
English
01-01-2010
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Data exchange
6 Requirements for all devices
7 Requirements for bare die and wafers with or without
connection structures
8 Minimally-packaged devices
9 Quality, test and reliability
10 Handling and packing
11 Storage
12 Assembly
Annex A (informative) - Terminology
Annex B (informative) - Acronyms
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Describes the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
50
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 62258-1:2010 | Identical |
| SN EN 62258-1 : 2005 | Identical |
| EN 62258-1:2010 | Identical |
| NF EN 62258-1 : 2011 | Identical |
| IEC 62258-1:2009 | Identical |
| NBN EN 62258-1 : 2010 | Identical |
| DIN EN 62258-1 : 2011 | Identical |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| IPC J STD 026 : 0 | SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS |
| ISO/IEC 11179-3:2013 | Information technology — Metadata registries (MDR) — Part 3: Registry metamodel and basic attributes |
| EN 62258-2:2011 | SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| MIL-PRF-19500 Revision P:2010 | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| EIA 554 : 1996 | METHOD SELECTION FOR ASSESSMENT OF NONCONFORMING LEVELS IN PARTS PER MILLION (PPM) |
| MIL-PRF-38534 Revision J:2015 | HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
| IEC TR 61340-5-2:2007 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
| IEC 60749-27:2006+AMD1:2012 CSV | Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) |
| IEC 62258-5:2006 | Semiconductor die products - Part 5: Requirements for information concerning electrical simulation |
| FED-STD-209 Revision E:1992 | AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC J STD 012 : 0 | IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
| IEC TR 62258-8:2008 | Semiconductor die products - Part 8: EXPRESS model schema for data exchange |
| IEC 61360-1:2017 | Standard data element types with associated classification scheme - Part 1: Definitions - Principles and methods |
| CLC/TR 62258-8:2008 | Semiconductor die products - Part 8: EXPRESS model schema for data exchange |
| CLC/TR 62258-3:2007 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| IEEE 1076-2008 REDLINE | IEEE Standard VHDL Language Reference Manual |
| EN 62258-6 : 2006 | SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION |
| IEC 60749-26:2013 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| EN 62258-5 : 2006 | SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION |
| IEC TR 62258-7:2007 | Semiconductor die products - Part 7: XML schema for data exchange |
| ISO 8879:1986 | Information processing Text and office systems Standard Generalized Markup Language (SGML) |
| IEC 62258-2:2011 | Semiconductor die products - Part 2: Exchange data formats |
| IEC TR 62258-3:2010 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| ISO 14644-1:2015 | Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration |
| IEC 62258-6:2006 | Semiconductor die products - Part 6: Requirements for information concerning thermal simulation |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| IPC J STD 028 : 0 | PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| CLC/TR 62258-4:2013 | Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
| IEC TR 62258-4:2012 | Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
| EIA 557 : 2006 | STATISTICAL PROCESS CONTROL SYSTEMS |
| EN ISO 14644-1:2015 | Cleanrooms and associated controlled environments - Part 1: Classification of air cleanliness by particle concentration (ISO 14644-1:2015) |
| CLC/TR 62258-7:2007 | Semiconductor die products - Part 7: XML schema for data exchange |
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