I.S. EN 62435-2:2017
Current
The latest, up-to-date edition.
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
Hardcopy , PDF
English
01-01-2017
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Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Principles of deterioration
5 Technical validation of the components
Annex A (normative) - Failure mechanisms - Encapsulated and
non-encapsulated active components
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines to deterioration mechanisms and is concerned with the way that components degrade over time depending on the storage conditions applied.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (06/2017)
|
| DocumentType |
Standard
|
| Pages |
50
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 62435-2:2017 | Identical |
| IEC 60749-21:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| EN 60749-20-1 : 2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| IEC 61760-4:2015 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
| IEC TR 61340-5-2:2007 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
| IEC TR 62380:2004 | Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| IEC TS 61945:2000 | Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| IEC TR 62258-3:2010 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| IEC 60721-3-3:1994+AMD1:1995+AMD2:1996 CSV | Classification of environmental conditions - Part 3-3: Classification of groups of environmental parameters and their severities - Stationary use at weatherprotected locations |
| IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| IEC 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| IEC 60721-3-1:1997 | Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage |
| EN 190000:1995 | Generic Specification: Monolithic integrated circuits |
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