I.S. EN IEC 60191-1:2018
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES
24-04-2018
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
National Foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General rules for all drawings
5 Additional rules
6 Inter-conversion of inch and millimetre dimensions
and rules for rounding off
7 Rules for coding
Annex A (informative) - Reference letter symbols
Annex B (informative) - Rules to specify the dimensions
and positions of terminals on a base drawing
Annex C (normative) - General philosophy of flat base devices
Annex D (normative) - Special rules for SMD-packages
Annex E (informative) - Examples of semiconductor
device drawings
Annex F (informative) - Former rules for rounding off
Annex G (informative) - Former rules for coding
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Provides guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. Supersedes I.S. EN 60191-1. (04/2018)
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| DocumentType |
Standard
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| PublisherName |
National Standards Authority of Ireland
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| Status |
Current
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| Standards | Relationship |
| IEC 60191-1:2007 | Identical |
| IEC 60191-6-3:2000 | Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) |
| IEC 60191-6-1:2001 | Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals |
| ISO 5459:2011 | Geometrical product specifications (GPS) — Geometrical tolerancing — Datums and datum systems |
| IEC 60191-6-21:2010 | Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) |
| EN 60191-6-3:2000 | Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| EN 60191-6-21 : 2010 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP) |
| EN 60191-6-1:2001 | Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals |
| ISO 261:1998 | ISO general purpose metric screw threads — General plan |
| ISO 370:1975 | Toleranced dimensions Conversion from inches into millimetres and vice versa |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| EN 60191-6-20:2010 | Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) |
| ISO 263:1973 | ISO inch screw threads General plan and selection for screws, bolts and nuts Diameter range 0,06 to 6 in |
| IEC 60191-6-20:2010 | Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) |
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