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IEC
IEC 60068-2-67:1995

IEC 60068-2-67:1995

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components

Amended by

IEC 60068-2-67:1995/AMD1:2019

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

13-07-2019

Superseded by

IEC 60068-2-67:1995+AMD1:2019 CSV

Language(s)

English - French, Russian, Spanish, Castilian

Published date

13-12-1995

Publisher

International Electrotechnical Committee

€41.59
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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
Hardcopy - Russian
PDF - Russian
PDF 3 Users - Russian
PDF 5 Users - Russian
PDF 9 Users - Russian
Hardcopy - Spanish
PDF - Spanish
PDF 3 Users - Spanish
PDF 5 Users - Spanish
PDF 9 Users - Spanish
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1 Scope
2 General description
3 Description of test apparatus
4 Severities
5 Pre-conditioning
6 Initial measurements
7 Testing
8 Intermediate measurements
9 Recovery
10 Final measurements
11 Information to be given in the relevant
    specification
Annexes
A (informative) Physical significance of the test
B (informative) Test apparatus and handling

IEC 60068-2-67:1995 Provides a standard test procedure for the purpose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically sealed components, to the deteriorative effect of damp heat. The test is not intended to evaluate external effects such as corrosion and deformation.

Committee
TC 104
DevelopmentNote
Also numbered as BS EN 60068-2.67. (09/2005) Stability Date: 2019. (10/2012)
DocumentType
Standard
Pages
21
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

BS ISO 16525-7:2014 Adhesives. Test methods for isotropic electrically conductive adhesives Environmental test methods
13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
15/30331587 DC : 0 BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
NF EN 60384-1 : 2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS EN 60384-1:2016 Fixed capacitors for use in electronic equipment Generic specification
ISO 16525-7:2014 Adhesives — Test methods for isotropic electrically conductive adhesives — Part 7: Environmental test methods
IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
IEC 60384-1:2016 RLV Fixed capacitors for use in electronic equipment - Part 1: Generic specification
EN 61010-2-012:2016 Safety requirements for electrical equipment for measurement, control and laboratory use - Part 2-012: Particular requirements for climatic and environmental testing and other temperature conditioning equipment
EN 60068-3-4:2002 Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests
EN 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
12/30254691 DC : DRAFT MAR 2012 BS ISO 16525-7 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 7: ENVIRONMENTAL TEST METHODS
14/30295051 DC : 0 BS ISO 19095-4 - ADHESIVES - EVALUATION OF THE ADHESION INTERFACE PERFORMANCE IN PLASTIC-METAL ASSEMBLIES - PART 4: ENVIRONMENTAL CONDITION FOR DURABILITY
14/30295038 DC : 0 BS ISO 19095-1 - ADHESIVES - EVALUATION OF THE ADHESION INTERFACE PERFORMANCE IN PLASTIC-METAL ASSEMBLIES - PART 1: GUIDELINES FOR THE APPROACH
BS EN 60068-3-4:2002 Environmental testing Supporting documentation and guidance - Damp heat tests
BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
CEI EN 60068-3-4 : 2002 ENVIRONMENTAL TESTING - PART 3-4: SUPPORTING DOCUMENTATION AND GUIDANCE DAMP HEAT TESTS
VDI/VDE 5570 Blatt 3:2017-06 Testing of connectorised and non-connectorised polymer optical fibres (POF) - Testing of mechanical characteristics, environmental influences and aging behaviour
CSA C22.2 No. 61010-2-012 : 2017 SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL AND LABORATORY USE - PART 2-012: PARTICULAR REQUIREMENTS FOR CLIMATIC AND ENVIRONMENTAL TESTING AND OTHER TEMPERATURE CONDITIONING EQUIPMENT
13/30279156 DC : 0 BS EN 6101-2-012 ED.1 - SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL, AND LABORATORY USE - PART 2-012: PARTICULAR REQUIREMENTS FOR CLIMATIC AND ENVIRONMENTAL TESTING AND OTHER TEMPERATURE CONDITIONING EQUIPMENT
15/30329267 DC : 0 BS EN 60747-17 - SEMICONDUCTOR DEVICES - PART 17: MAGNETIC AND CAPACITIVE COUPLER FOR BASIC AND REINFORCED ISOLATION
BS EN 60115-1 : 2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
IEC 60115-1:2008 Fixed resistors for use in electronic equipment - Part 1: Generic specification
IEC PAS 60747-17:2011 Semiconductor devices - Discrete devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation
I.S. EN 60115-1:2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
BS ISO 19095-1:2015 Plastics. Evaluation of the adhesion interface performance in plastic-metal assemblies Guidelines for the approach
07/30149142 DC : 0 BS IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
14/30280850 DC : 0 BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
12/30254694 DC : DRAFT MAR 2012 BS ISO 16525-8 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 8: ELECTROCHEMICAL-MIGRATION TEST METHODS
CEI EN 61189-5-503 : 1ED 2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
BS EN 61010-2-012:2016 Safety requirements for electrical equipment for measurement, control and laboratory use Particular requirements for climatic and environmental testing and other temperature conditioning equipment
I.S. EN 61010-2-012:2016 SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL AND LABORATORY USE - PART 2-012: PARTICULAR REQUIREMENTS FOR CLIMATIC AND ENVIRONMENTAL TESTING AND OTHER TEMPERATURE CONDITIONING EQUIPMENT
I.S. EN 61189-5-503:2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
ISO 20456:2017 Measurement of fluid flow in closed conduits — Guidance for the use of electromagnetic flowmeters for conductive liquids
EN 60384-1:2016 Fixed capacitors for use in electronic equipment - Part 1: Generic specification
ISO 19095-1:2015 Plastics Evaluation of the adhesion interface performance in plastic-metal assemblies Part 1: Guidelines for the approach
EN 60115-1:2011/A11:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
IEC 60384-1:2016 Fixed capacitors for use in electronic equipment - Part 1: Generic specification
PD IEC/TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
IEC 60068-3-4:2001 Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests
DD IEC/PAS 60747-17:2011 Semiconductor devices. Discrete devices Magnetic and capacitive coupler for basic and reinforced isolation
13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
BS ISO 16525-8:2014 Adhesives. Test methods for isotropic electrically conductive adhesives Electrochemical-migration test methods
I.S. EN 60068-3-4:2002 ENVIRONMENTAL TESTING - PART 3-4: SUPPORTING DOCUMENTATION AND GUIDANCE - DAMP HEAT TESTS
ISO 16525-8:2014 Adhesives — Test methods for isotropic electrically conductive adhesives — Part 8: Electrochemical-migration test methods
IEC 60300-3-5:2001 Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles

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