IEC 60191-6-4:2003
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
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English, English - French
11-06-2003
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Reference character and drawings
4.1 Ball grid array package (BGA) Type 1 - Ball datum
4.2 Ball grid array package (BGA) Type 2 - Body datum
5 Measuring method
5.1 Datum S as pertaining to ball coplanarity
5.2 Datum A, B
5.3 Definition of specified dimensions and measuring method
5.4 Profile of a package edge surface v
5.5 Mounting height A
5.6 First stand-off A1
5.7 Second stand-off A4
5.8 Ball diameter b
5.9 Ball centre position X
5.10 Ball coplanarity y
5.11 Package top flatness y1
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
Stability Date: 2017. (10/2012) A Bilingual edition has been published. (12/2012)
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NEN EN IEC 60191-6-4 : 2003 | Identical |
| PN EN 60191-6-4 : 2004 | Identical |
| SN EN 60191-6-4 : 2003 | Identical |
| UNE-EN 60191-6-4:2003 | Identical |
| CEI EN 60191-6-4 : 2004 | Identical |
| EN 60191-6-4:2003 | Identical |
| DIN EN 60191-6-4:2004-01 | Identical |
| NF EN 60191-6-4 : 2003 | Identical |
| BS EN 60191-6-4:2003 | Identical |
| I.S. EN 60191-6-4:2003 | Identical |
| BS EN 60191-6-18:2010 | Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA) |
| EN 60191-6-18:2010 | Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) |
| IEC PAS 60191-6-18:2008 | Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) |
| CEI EN 60191-6-18 : 2011 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA) |
| I.S. EN 60191-6-18:2010 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA) |
| IEC 60191-6-18:2010 | Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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