IEC 60749-43:2017
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Superseded date
25-08-2021
Language(s)
English - French
Published date
15-06-2017
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.IEC 60749-43:2017 gives guidelines for reliability qualification plans of semiconductor integrated circuit products (ICs). This document is not intended for military- and space-related applications.
| DevelopmentNote |
Stability Date: 2023. (06/2017)
|
| DocumentType |
Standard
|
| Pages |
74
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| Standards | Relationship |
| NEN EN IEC 60749-43 : 2017 | Identical |
| EN 60749-43:2017 | Identical |
| BS EN 60749-43:2017 | Identical |
| NF EN 60749-43 : 2017 | Identical |
| DS EN 60749-43 : 2017 | Identical |
| SN EN 60749-43 : 2017 | Identical |
| PN EN 60749-43 : 2018 | Identical |
| UNE-EN 60749-43:2017 | Identical |
| PNE-FprEN 60749-43 | Identical |
| CEI EN 60749-43 : 1ED 2018 | Identical |
| IEC 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
| I.S. EN 60749-6:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 6: STORAGE AT HIGH TEMPERATURE |
| BS EN 60749-6:2017 | Semiconductor devices. Mechanical and climatic test methods Storage at high temperature |
| 16/30344796 DC : 0 | BS EN 60749-6 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 6: STORAGE AT HIGH TEMPERATURE |
| EN 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IECQ 03-1:2012 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 1: GENERAL REQUIREMENTS FOR ALL IECQ SCHEMES |
| IEC 60749-28:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level |
| IECQ 03-6:2012 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 6: IECQ ITL SCHEME - INDEPENDENT TESTING LABORATORY ASSESSMENT PROGRAM REQUIREMENTS |
| IEC 60749-21:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| IECQ 03-3:2013 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 3: IECQ APPROVED COMPONENT PRODUCTS, RELATED MATERIALS & ASSEMBLIES SCHEME |
| IEC 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
| IEC 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
| IEC 60749-29:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test |
| IEC 60749-11:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method |
| IECQ 03-3-2:2014 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PRODECURE - PART 3-2: IECQ APPROVED COMPONENT PRODUCTS, RELATED MATERIALS & ASSEMBLIES SCHEME, IECQ APPROVED COMPONENT - AUTOMOTIVE QUALIFICATION PROGRAMME (IECQ AC-AQP) |
| IECQ 01:2014 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - BASIC RULES |
| IECQ 03-3-1:2013 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 3-1: IECQ APPROVED COMPONENT PRODUCTS, RELATED MATERIALS & ASSEMBLIES SCHEME, IECQ APPROVED COMPONENT-TECHNOLOGY CERTIFICATION (IECQ AC-TC) |
| IEC 60749-15:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
| IEC 60749-26:2013 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| IECQ 03-4:2014 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PRODECURE - PART 4: IECQ AVIONICS SCHEME - AVIONICS PARTS AND ASSEMBLY MANAGEMENT |
| IECQ 03-7:2013 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 7: IECQ COUNTERFEIT AVOIDANCE PROGRAMME (IECQ AP-CAP) - PROGRAMME REQUIREMENTS |
| IECQ 03-5:2014 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PRODECURE - PART 5: IECQ HSPM SCHEME - HAZARDOUS SUBSTANCE PROCESS MANAGEMENT REQUIREMENTS |
| IEC 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
| IEC 60749-42:2014 | Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IECQ 01A:2013 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - IECQ GUIDE - GUIDANCE FOR THE USE OF THE IECQ LOGO AND IECQ MARK OF CONFORMITY |
| IECQ 03-2:2013 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 2: IECQ APPROVED PROCESS SCHEME |
| IECQ 03-8:2015 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 8: IECQ SCHEME FOR LED LIGHTING |
| IEC 60749-23:2004+AMD1:2011 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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