IEC 61163-1:2006

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Symbols
5 General description
  5.1 The reliability stress screening principle
  5.2 Failure categories
  5.3 Time of occurrence of failures
6 Planning
  6.1 Stress conditioning
  6.2 Evaluation of the failure-free period T[M]
  6.3 Time graphs for determination of the failure-free period
7 Pilot-production screening
  7.1 General
  7.2 Collection of information
  7.3 Evaluation of information
  7.4 Re-evaluating the failure-free period T[M]
8 Mature production screening
  8.1 General
  8.2 Collection of information
  8.3 Evaluation of information
  8.4 Dealing with discrepancies
  8.5 Eliminating reliability stress screening
Annex A (informative) Stress conditions - General information
Annex B (informative) Stress conditions - Temperature
Annex C (informative) Stress conditions - Vibration and bump
Annex D (informative) Stress conditions - Humidity
Annex E (informative) Stress conditions - Operational stress
Annex F (informative) Voltage stress
Annex G (informative) Highly accelerated stress screening
Annex H (informative) Bimodal distributions - Weibull plotting
                      and analysis
Annex I (informative) Evaluation of the failure-free period
                      and the average screening duration
Annex J (informative) Worked example
Bibliography

This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable.