IEC 61182-2:2006
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
31-12-2021
English
27-09-2006
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
1 Scope and object
1.1 Focus and intent
1.2 Notation
2 Normative references
3 Documentation conventions
4 Requirements
4.1 Rules concerning the use of XML and XML Schema
4.2 Data organization and identification rules
4.3 Transformation characteristics (Xform)
4.4 Substitution groups
5 Content
5.1 Content: FunctionMode
5.2 Function levels
5.3 Content: StepListRef
5.4 Content: LayerDescRef
5.5 Content: BomRef
5.6 Content: AvlRef
5.7 Content: DictionaryStandard
5.8 Content: DictionaryUser
5.9 Content: DictionaryFont
5.10 Content: DictionaryLineDesc
5.11 Content: DictionaryColor
5.12 Content: DictionaryFirmware
6 Logistic header
6.1 LogisticHeader
6.2 Role
6.3 Enterprise
6.4 Person
7 History record
7.1 HistoryRecord
7.2 FileRevision
7.3 SoftwarePackage
7.4 ChangeRec
8 BOM (Material List)
8.1 BOM Header
8.2 BomItem
9 Electronic computer aided design (ecad)
9.1 CadHeader
9.2 CadData/LayerDesc
9.3 CadData/StepList
10 Approved vendor list (AVL)
10.1 AvlHeader
10.2 AvlItem
11 Glossary.
Annexe A (informative) IPC-7351 Naming Convention for Land
Patterns
Annexe B - Informative references
Specifies the XML Schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements.
| DocumentType |
Standard
|
| Pages |
161
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| NEN IEC 61182-2 : 2006 | Identical |
| BS IEC 61182-2:2006 | Identical |
| BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
| 16/30333621 DC : 0 | BS EN 61188-7 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION |
| EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| IPC 2588 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION |
| IPC 2583 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION |
| IPC 2582 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION |
| 07/30169578 DC : 0 | BS EN 61188-7 - PRINTED BOARD AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: SECTIONAL REQUIREMENTS - ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION |
| IPC 2584 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION |
| IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
| ANSI Y14.5 : 1973 | DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS |
| IEC 61188-5-3:2007 | Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IEC 61188-5-8:2007 | Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) |
| DOD STD 100 : C NOTICE 6 | ENGINEERING DRAWING PRACTICES |
| IPC 2578 : 0 | SECTIONAL REQUIREMENTS FOR SUPPLY CHAIN COMMUNICATION OF BILL OF MATERIAL AND PRODUCT DESIGN CONFIGURATION DATA - PRODUCT DATA EXCHANGE |
| IPC D 325 : A | DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
| ISO 10303-212:2001 | Industrial automation systems and integration — Product data representation and exchange — Part 212: Application protocol: Electrotechnical design and installation |
| ANSI Z210.1 : LATEST | METRIC PRACTICE GUIDE |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC 2615 : 0 | PRINTED BOARD DIMENSIONS AND TOLERANCES |
| IPC 2524 : 0 | PWB FABRICATION DATA QUALITY RATING SYSTEM |
| IPC 2576 : 0 | SECTIONAL REQUIREMENTS FOR ELECTRONICS MANUFACTURING SUPPLY CHAIN COMMUNICATION OF AS-BUILT PRODUCT DATA - PRODUCT DATA EXCHANGE (PDX) |
| IPC 2511 : B | GENERIC REQUIREMENTS FOR IMPLEMENTATION OF PRODUCT MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
| IPC 4104 : 1999 | SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS |
| IPC 2571 : 2001 | GENERIC REQUIREMENTS FOR ELECTRONIC MANUFACTURING SUPPLY CHAIN COMMUNICATION - PRODUCT DATA EXCHANGE (PDX) |
| IPC D 310 : C | GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES |
| IEC 61188-5-6:2003 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61188-5-5:2007 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
| IPC 2501 : 0 | DEFINITION FOR WEB-BASED EXCHANGE OF XML DATA |
| ISO 10303-210:2011 | Industrial automation systems and integration Product data representation and exchange Part 210: Application protocol: Electronic assembly, interconnect, and packaging design |
| IEC 61188-5-4:2007 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides |
| IPC 4103 : A | SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS |
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