IEC 61188-5-8:2007
Current
The latest, up-to-date edition.
Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French
30-10-2007
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Carrier packaging format
3.4 Process considerations
4 BGA (square)
4.1 Field of application
4.2 Component descriptions
4.2.1 Basic construction
4.2.2 Termination materials
4.2.3 Marking
4.2.4 Carrier package format
4.2.5 Process considerations
4.3 Component dimensions (square)
4.3.1 PBGA 1,5 mm pitch component dimensions (square)
4.3.2 PBGA 1,27 mm pitch component dimensions (square)
4.3.3 PBGA 1,00 mm pitch component dimensions (square)
4.4 Solder joint fillet design
4.4.1 Solder joint fillet design - Non-collapsing,
collapsing (level 3)
4.5 Land pattern dimensions
4.5.1 PBGA 1,5 mm pitch land pattern dimensions (square)
4.5.2 PBGA 1,27 mm pitch land pattern dimensions (square)
4.5.3 PBGA 1,00 mm pitch land pattern dimensions (square)
5 FBGA (square)
6 BGA (rectangular)
6.1 Field of application
6.2 Component descriptions
6.2.1 Basic construction
6.2.2 Termination materials
6.2.3 Marking
6.2.4 Carrier package format
6.2.5 Process considerations
6.3 Component dimensions (rectangular)
6.4 Solder joint fillet design
6.4.1 Solder joint fillet design - Collapsing (level 3)
6.4.2 Land approximation
6.4.3 Total variation
6.5 Land pattern dimensions
7 FBGA (rectangular)
8 CGA
9 LGA
Bibliography
IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.
This publication is to be read in conjunction with IEC 61188-5-1:2002.
Committee |
TC 91
|
DevelopmentNote |
To be read in conjunction with IEC 61188-5-1. (10/2007) Stability Date: 2017. (09/2017)
|
DocumentType |
Standard
|
Pages |
30
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Standards | Relationship |
NF EN 61188-5-8 : 2016 | Identical |
GOST IEC 61188-5-8 : 2013 | Identical |
NEN EN IEC 61188-5-8 : 2008 | Identical |
I.S. EN 61188-5-8:2008 | Identical |
PN EN 61188-5-8 : 2008 | Identical |
UNE-EN 61188-5-8:2008 | Identical |
BS EN 61188-5-8:2008 | Identical |
CEI EN 61188-5-8 : 2008 | Identical |
EN 61188-5-8:2008 | Identical |
DIN EN 61188-5-8:2008-07 | Identical |
PNE-EN 61188-5-8 | Identical |
I.S. EN 62137-1-5:2009 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS - PART 1-5: MECHANICAL SHEAR FATIGUE TEST |
BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
16/30333621 DC : 0 | BS EN 61188-7 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION |
IEC 61182-2:2006 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
EN 62137-1-5:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test |
EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
CEI EN 62137-1-5 : 2010 | SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST |
17/30352677 DC : 0 | BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN |
BS EN 62137-1-5:2009 | Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test |
07/30169578 DC : 0 | BS EN 61188-7 - PRINTED BOARD AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: SECTIONAL REQUIREMENTS - ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION |
IEC 62137-4:2014 | Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices |
IEC 62137-1-5:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test |
IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
BS IEC 61182-2:2006 | Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements |
12/30271778 DC : 0 | BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
BS EN 62137-4:2014 | Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices |
I.S. EN 62137-4:2014 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
EN 62137-4:2014/AC:2015 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014) |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 62090:2017 | Product package labels for electronic components using bar code and two-dimensional symbologies |
IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
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