IEC 61188-5-8:2007
Current
The latest, up-to-date edition.
Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French
30-10-2007
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Carrier packaging format
3.4 Process considerations
4 BGA (square)
4.1 Field of application
4.2 Component descriptions
4.2.1 Basic construction
4.2.2 Termination materials
4.2.3 Marking
4.2.4 Carrier package format
4.2.5 Process considerations
4.3 Component dimensions (square)
4.3.1 PBGA 1,5 mm pitch component dimensions (square)
4.3.2 PBGA 1,27 mm pitch component dimensions (square)
4.3.3 PBGA 1,00 mm pitch component dimensions (square)
4.4 Solder joint fillet design
4.4.1 Solder joint fillet design - Non-collapsing,
collapsing (level 3)
4.5 Land pattern dimensions
4.5.1 PBGA 1,5 mm pitch land pattern dimensions (square)
4.5.2 PBGA 1,27 mm pitch land pattern dimensions (square)
4.5.3 PBGA 1,00 mm pitch land pattern dimensions (square)
5 FBGA (square)
6 BGA (rectangular)
6.1 Field of application
6.2 Component descriptions
6.2.1 Basic construction
6.2.2 Termination materials
6.2.3 Marking
6.2.4 Carrier package format
6.2.5 Process considerations
6.3 Component dimensions (rectangular)
6.4 Solder joint fillet design
6.4.1 Solder joint fillet design - Collapsing (level 3)
6.4.2 Land approximation
6.4.3 Total variation
6.5 Land pattern dimensions
7 FBGA (rectangular)
8 CGA
9 LGA
Bibliography
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