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IEC 61190-1-3:2017
Current
The latest, up-to-date edition.
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Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
13-12-2017
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Classification
5 Requirements
6 Quality assurance provisions
7 Preparation for delivery - Preservation,
packing and packaging
Annex A (informative) - Selection of various
alloys and fluxes for use in electronic
soldering - General information concerning
IEC 61190-1-3
Annex B (normative) - Lead-free solder alloys
Annex C (informative) - Marking method of solder
designation for mounted board, used
in electronic equipment
Bibliography
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