IEC 61190-1-3:2017
Current
The latest, up-to-date edition.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
13-12-2017
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Classification
5 Requirements
6 Quality assurance provisions
7 Preparation for delivery - Preservation,
packing and packaging
Annex A (informative) - Selection of various
alloys and fluxes for use in electronic
soldering - General information concerning
IEC 61190-1-3
Annex B (normative) - Lead-free solder alloys
Annex C (informative) - Marking method of solder
designation for mounted board, used
in electronic equipment
Bibliography
IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
This edition includes the following significant technical changes with respect to the previous edition:
a) The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.
Committee |
TC 91
|
DevelopmentNote |
Stability Date: 2024. (12/2017)
|
DocumentType |
Standard
|
Pages |
86
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Supersedes |
Standards | Relationship |
DS/EN IEC 61190-1-3:2018 | Identical |
SN EN 61190-1-3:2007 | Identical |
SN EN IEC 61190-1-3:2018 | Identical |
SS-EN IEC 61190-1-3:2018 | Identical |
PN-EN IEC 61190-1-3:2018-05 | Identical |
NF EN IEC 61190-1-3:2018 | Identical |
EN 61190-1-3:2007 | Identical |
CEI EN IEC 61190-1-3:2018 | Identical |
NEN-EN-IEC 61190-1-3:2018 | Identical |
EN IEC 61190-1-3:2018 | Identical |
UNE-EN IEC 61190-1-3:2018 | Identical |
BS EN IEC 61190-1-3:2018 | Identical |
IEC 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
IEC 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
ISO 9454-2:1998 | Soft soldering fluxes Classification and requirements Part 2: Performance requirements |
ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
IEC 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
IEC 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
ISO 1073-1:1976 | Alphanumeric character sets for optical recognition Part 1: Character set OCR-A Shapes and dimensions of the printed image |
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