IEC 61192-5:2007
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
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31-12-2021
English, English - French
23-05-2007
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FOREWORD
1 Scope
2 Normative references
3 Terminology
3.1 Terms and definitions
3.2 Abbreviations
4 Classification of rework activities
4.1 Pre-soldering rework
4.2 Post-soldering rework
4.3 Essential prerequisites for successful and
reliable rework
5 Pre-soldering rework
5.1 General
5.2 Reworking solder paste and non-conducting adhesive
deposits
5.2.1 General
5.2.2 General misalignment or smudging of deposits
5.2.3 Local misalignment or smudging of deposit
5.2.4 General paste or adhesive quantity incorrect
5.2.5 Local paste or adhesive quantity incorrect
5.3 Reworking placed components
5.3.1 General overall component misalignment
5.3.2 Local component misalignment
5.4 Realigning components after curing thermoplastic
adhesive
5.5 Realigning components after curing thermosetting
adhesive
6 Factors affecting post-soldering rework
6.1 Component marking and unmarked components
6.2 Reuse of removed components
6.3 Sensitive components
6.4 Printed board layout design and space constraints
6.5 Heat-sink effects
6.6 Printed board material type
6.7 Solder resist material and aperture size
6.8 Reworking individual fine pitch device leads
6.9 Reworking grid arrays
7 Preparation for post-soldering rework and repair
7.1 Electrostatic precautions
7.2 Avoiding exposure of components to contaminants
7.3 Removal of conformal coating
7.4 Unsuitable components
7.5 Cleaning prior to rework
7.6 Protecting adjacent sensitive components
7.7 Baking of assemblies prior to component replacement
7.8 Preheating large multilayer boards
7.9 Preheating replacement sensitive components
8 Post-soldering rework
8.1 General
8.2 Component realignment (tweaking)
8.3 Component removal
8.4 Removal of adjacent components
8.5 Reuse of components
8.6 Addition of flux and solder
8.7 Topping-up
8.8 Removal of excess solder from joints
8.9 Preparation of lands before component replacement
8.10 Component replacement
8.11 Cleaning (if required)
8.12 Visual inspection and electrical testing
8.13 Checking thermal integrity of solder joints
8.14 Replacement of local conformal coating (if required)
9 Selection of rework equipment, tools and methods
9.1 General
9.2 Matching rework equipment to component and
printed-board prerequisites
9.2.1 General
9.2.2 Selection based on component types on the
printed board
9.2.3 Selection based on printed-board laminate
material type
9.2.4 Selection based on assembly structure and
soldering processes
10 Manual rework tools and methods
10.1 General
10.2 Miniature conventional (stored energy) soldering
irons
10.3 Directly heated soldering irons
10.4 Hot air/gas pencils
10.5 Heated tweezers
10.6 Soldering irons with special tips
11 Mechanized and programmable rework machines
11.1 General
11.2 Hot air rework machines
11.3 Focused infrared (IR) equipment
11.4 Thermode (heated electrode) equipment
11.5 Laser equipment for de-soldering
12 Ancillary tools and equipment
12.1 Conventional soldering irons
12.2 Hotplates
12.3 Pneumatic dispensers
12.4 De-soldering tools, as used for through-hole
assemblies
12.5 Tweezers and vacuum pencils
12.6 Solder pots
12.7 Copper braid
13 Rework recording procedures
13.1 General
13.2 Anomaly charts
13.3 Travelling documents
13.4 Rework status
14 Training of operators and inspectors
15 Field repair
Bibliography
IEC 61192-5:2007 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. It also contains guidance on design matters where they have relevance to rework.
| Committee |
TC 91
|
| DevelopmentNote |
A Bilingual edition has been published. (05/2008) Stability Date: 2017. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| GOST R IEC 61192-5 : 2010 | Identical |
| NF EN 61192-5 : 2008 | Identical |
| NEN EN IEC 61192-5 : 2007 | Identical |
| I.S. EN 61192-5:2007 | Identical |
| PN EN 61192-5 : 2010 | Identical |
| BS EN 61192-5:2007 | Identical |
| CEI EN 61192-5 : 2008 | Identical |
| EN 61192-5 : 2007 | Identical |
| DIN EN 61192-5:2007-12 | Identical |
| PNE-prEN 61192-5 | Identical |
| UNE-EN 61192-5:2007 | Identical |
| IEC 61193-1:2001 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| IPC 7711 : 1998 | REWORK OF ELECTRONIC ASSEMBLIES |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 61192-3:2002 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| IEC 61192-4:2002 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 9001:2015 | Quality management systems — Requirements |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| IEC 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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