IEC 61249-2-22:2005
Current
The latest, up-to-date edition.
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
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English - French
11-01-2005
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FOREWORD
1 Scope
2 Normative references
3 Materials and construction
3.1 Resin system
3.2 Metal foil
3.3 Reinforcement
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
6.1 Appearance of the copper-clad sheet
6.2 Appearance of the unclad face
6.3 Laminate thickness
6.4 Bow and twist
6.5 Properties related to the copper foil bond.
6.6 Punching and machining
6.7 Dimensional stability
6.8 Sheet sizes
6.9 Cut panels
7 Non-electrical properties of the base material after complete
removal of the copper foil
7.1 Appearance of the dielectric base material
7.2 Flexural strength
7.3 Flammability
7.4 Water absorption
7.5 Measling
7.6 Glass transition temperature and cure factor
8 Quality assurance
8.1 Quality system
8.2 Responsibility for inspection
8.3 Qualification inspection
8.4 Quality conformance inspection
8.5 Certificate of conformance
8.6 Safety data sheet
9 Packaging and marking
10 Ordering information
Annex A (informative) Engineering information
Annex B (informative) Common laminate constructions
Annex C (informative) Guideline for qualification and conformance
inspection
Bibliography
This part of IEC 61249 gives requirements for properties of modified non-halogenated epoxide woven E-glass laminated sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The flammability rating is achieved through the use of phosphorus compounds and/or aluminium hydroxide fire retardants contained as part of the polymeric structure. The glass transition temperature is defined to be between 150 °C to 190 °C.
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
49
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61249-2-22 : 2005 | Identical |
| NEN EN IEC 61249-2-22 : 2005 | Identical |
| I.S. EN 61249-2-22:2005 | Identical |
| PN EN 61249-2-22 : 2005 | Identical |
| UNE-EN 61249-2-22:2005 | Identical |
| BS EN 61249-2-22:2005 | Identical |
| CEI EN 61249-2-22 : 2005 | Identical |
| EN 61249-2-22:2005 | Identical |
| DIN EN 61249-2-22:2005-08 | Identical |
| IEC 60571:2012 | Railway applications - Electronic equipment used on rolling stock |
| IEC PAS 63015:2016 | Definition of "Low-Halogen" for electronic products |
| BS EN 50155:2017 | Railway applications. Rolling stock. Electronic equipment |
| BS EN 60115-1 : 2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| CEI EN 60068-2-58 : 2016 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| I.S. EN 50155:2017-11 | RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT |
| BS EN 60068-2-58 : 2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| IEC 60115-1:2008 | Fixed resistors for use in electronic equipment - Part 1: Generic specification |
| I.S. EN 60115-1:2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
| EN 50155:2017 | Railway applications - Rolling stock - Electronic equipment |
| 11/30247723 DC : 0 | BS IEC 60571 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK |
| EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| PD IEC/PAS 63015:2016 | Definition of “Low-Halogen” for electronic products |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| I.S. EN 60068-2-58:2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| EN 60068-2-58:2015/A1:2018 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
| ISO 11014-1:1994 | Safety data sheet for chemical products Part 1: Content and order of sections |
| IEC 61249-5-1:1995 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| ISO 14001:2015 | Environmental management systems — Requirements with guidance for use |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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