IEC 61760-3:2010
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
12-09-2022
English - French
16-03-2010
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FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements to component design and component
specifications
5 Specification of assembly process conditions
6 Typical process conditions
7 Requirements for components and component specifications
for THR soldering processes
IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.
| DevelopmentNote |
Stability Date: 2019. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
45
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| OVE/ONORM EN 61760-3 : 2011 | Identical |
| NBN EN 61760-3 : 2010 | Identical |
| NEN EN IEC 61760-3 : 2010 | Identical |
| I.S. EN 61760-3:2010 | Identical |
| PN EN 61760-3 : 2010 | Identical |
| UNE-EN 61760-3:2010 | Identical |
| BS EN 61760-3:2010 | Identical |
| CEI EN 61760-3 : 2010 | Identical |
| EN 61760-3:2010 | Identical |
| NF EN 61760-3 : 2010 | Identical |
| DIN EN 61760-3:2010-12 | Identical |
| 11/30243259 DC : 0 | BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| BS EN 60068-2-58 : 2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| I.S. EN 60068-2-58:2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| EN 60068-2-58:2015/A1:2018 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 62090:2017 | Product package labels for electronic components using bar code and two-dimensional symbologies |
| IEC 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| ISO 8601:2004 | Data elements and interchange formats Information interchange Representation of dates and times |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60062:2016 | Marking codes for resistors and capacitors |
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