IEC 62137-3:2011

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Procedure of selecting the applicable test method
6 Common subjects in each test method
7 Evaluation test method
Annex A (informative) - Condition of rapid temperature
        change
Annex B (informative) - Electrical continuity test for
        solder joint
Annex C (informative) - Torque shear strength test
Annex D (informative) - Monotonic bending strength test
Annex E (informative) - Cyclic steel ball drop strength test
Annex F (informative) - Pull strength test
Annex G (informative) - Creep strength test
Annex H (informative) - Evaluation method for the fillet lifting
        phenomenon of a lead insertion type device solder joint
Bibliography

IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:
- no technical changes;
- some editorial changes and corrections;
- for the sake of convenience some constitutive changes.