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IEC TR 62258-3:2010
Current
The latest, up-to-date edition.
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Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French, Russian
06-08-2010
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Handling - Good practice
5 Process handling issues
6 Die and wafer transport and storage media
7 Storage good practice
8 Traceability good practice
9 Guidelines for long-term storage (die banking) of
bare die and wafers
10 Good practice for automated handling during
assembly
Annex A (informative) - Planning checklist
Annex B (informative) - Material specifications
Bibliography
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