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IPC 2224 : 0

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

SECTIONAL STANDARD FOR DESIGN OF PWBS FOR PC CARDS

Withdrawn date

22-05-2016

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1.0 SCOPE
     1.1 Purpose
     1.2 Documentation Hierarchy
     1.3 Presentation
     1.4 Interpretation
     1.5 Classification of Products
2.0 APPLICABLE DOCUMENTS
     2.1 Reference Documents
3.0 GENERAL REQUIREMENTS
     3.1 Test Requirement Considerations
4.0 MATERIALS
     4.1 Material Selection
     4.2 Bonding Material
     4.3 Laminate Materials
     4.4 Flexible Substrates
     4.5 Conductive Materials
     4.6 Organic Protective Coatings
     4.7 Marking and Legends
     4.8 Thickness Class Tolerance
5.0 MECHANICAL/PHYSICAL PROPERTIES
     5.1 Fabrication Requirements
     5.2 Product/Board Configuration
     5.3 Assembly Requirements
     5.4 Dimensioning Systems
     5.5 Structural Strength
6.0 ELECTRICAL PROPERTIES
7.0 THERMAL MANAGEMENT
     7.1 Convection
     7.2 Heat Dissipation Considerations
8.0 COMPONENT AND ASSEMBLY ISSUES
     8.1 General Placement Requirements
     8.2 Plated-Through Hole Requirements
     8.3 Mounting Methods for Connectors
     8.4 Stiffeners
     8.5 Fine Pitch SMT (Peripherals)
     8.6 Array SMT (BGA, ?BGA, etc.)
     8.7 Bare Die
     8.8 Tape Automated Bonding
     8.9 Castellations
     8.10 Bottom Only Terminations
9.0 HOLES/INTERCONNECTIONS
     9.1 General Requirements for Lands with Holes
     9.2 Holes
     9.3 Drill Size Recommendations for Printed
          Boards
10.0 GENERAL CIRCUIT FEATURE REQUIREMENTS
     10.1 Conductor Characteristics
     10.2 Land Characteristics
11.0 DOCUMENTATION
     11.1 Artwork
12.0 QUALITY ASSURANCE
Figures
Tables

Establishes the requirements for the design of printed boards for PC card form factors. The organic materials may be reinforced, homogeneous, or used in combination with inorganic materials; interconnections may be single, double or multilayered.

DevelopmentNote
To be used in conjunction with IPC 2221. (06/2002) Included in IPC 2220 Series. Also available in CD-ROM format. (09/2005)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Withdrawn

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IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
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IPC CM 770 : E COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS
IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2222 : A SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
IPC M 106 : LATEST TECHNOLOGY REFERENCE FOR DESIGN MANUAL
IPC D 317 : A1995 DESIGN GUIDELINES FOR ELECTRONIC PACKAGING UTILIZING HIGH SPEED TECHNIQUES
IPC D 316 : 1995 HIGH FREQUENCY DESIGN GUIDE
IPC SM 782 : A1993 AMD 2 1999 SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

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