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IPC 2251 : 0

Current

Current

The latest, up-to-date edition.

DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS

Available format(s)

Hardcopy

Language(s)

English

Published date

01-11-2003

1 General
  1.1 Purpose
  1.2 Scope
  1.3 Symbology, Terms and Definitions
  1.4 Units
2 Applicable Documents
3 Overview
  3.1 Decision Making Process
  3.2 Design Options
  3.3 Mechanical Requirements
  3.4 Electrical Considerations
4 Mechanical Considerations
  4.1 Printed Board
  4.2 Component Materials
  4.3 Thermal Considerations
  4.4 Component Placement
5 Electrical Considerations
  5.1 Power Distribution
  5.2 Permittivity
  5.3 Lumped Capacitance Versus Transmission Line Environment
  5.4 Propagation Delay Time
  5.5 Impedance Models
  5.6 Loading Effects
  5.7 Crosstalk
  5.8 Signal Attenuation
  5.9 Computer Simulation Program
  5.10 Connectors
  5.11 EMI Layout Considerations
6 Performance Testing
  6.1 Impedance Testing
  6.2 Impedance Test Structures and Test Coupons
  6.3 Stripline Impedance Test Coupon
Appendix A
Appendix B
Appendix C
Appendix D
Figures
Tables

Provides guidelines for the design of high-speed circuitry. Intended to be used by circuit designers, packaging engineers, circuit board fabrication, and procurements personnel.

Committee
D-20
DevelopmentNote
Supersedes IPC D 317 (01/2004) Included in IPC C 106, IPC C 105 & IPC C 1000. (07/2008)
DocumentType
Guide
Pages
49
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

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IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
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MIL-PRF-31032-6 Revision B:2017 PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
MIL-PRF-31032-5 Revision B:2017 PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 2141 : A DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS
IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards
MIL-HDBK-1861 Revision B:2013 Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 6013 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS

IPC 2252 : 0 DESIGN GUIDE FOR RF/MICROWAVE CIRCUIT BOARDS
IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
IPC 6018 : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARDS
IPC 2141 : A DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS
IPC M 105 : LATEST RIGID PRINTED BOARD MANUAL
IPC M 106 : LATEST TECHNOLOGY REFERENCE FOR DESIGN MANUAL
IPC 4103 : A SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS

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