• NF EN 61188-5-1 : 2003

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS

    Available format(s): 

    Superseded date:  11-11-2021

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Association Francaise de Normalisation

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 Design requirements
       4.1 General
            4.1.1 Classification
            4.1.2 Land pattern determination
       4.2 Dimensioning systems
            4.2.1 Component tolerancing
            4.2.2 Land tolerancing
            4.2.3 Fabrication allowances
            4.2.4 Assembly tolerancing
            4.2.5 Dimension and tolerance analysis
       4.3 Design producibility
            4.3.1 SMT land pattern
            4.3.2 Standard component selection
            4.3.3 Circuit substrate development
            4.3.4 Assembly considerations
            4.3.5 Provision for automated test
            4.3.6 Documentation for SMT
       4.4 Environmental constraint
            4.4.1 Moisture sensitive components
            4.4.2 End-use environment considerations
       4.5 Design rules
            4.5.1 Component spacing
            4.5.2 Single- and double-sided board assembly
            4.5.3 Solder paste stencil
            4.5.4 Component stand-off height for cleaning
            4.5.5 Fiducial marks
            4.5.6 Conductors
            4.5.7 Via guidelines
            4.5.8 Standard fabrication allowances
            4.5.9 Panelization
       4.6 Outer layer finishes
            4.6.1 Solder-mask finishes
            4.6.2 Solder-mask clearances
            4.6.3 Land-pattern finishes
    5 Quality and reliability validation
       5.1 Validation techniques
    6 Testability
       6.1 Five types of testing
            6.1.1 Bare-board test
            6.1.2 Assembled board test
       6.2 Nodal access
            6.2.1 Test philosophy
            6.2.2 Test strategy for bare boards
       6.3 Full nodal access for assembled board
            6.3.1 In-circuit test accommodation
            6.3.2 Multi-probe testing
       6.4 Limited nodal access
       6.5 No nodal access
       6.6 Clam-shell fixtures impact
       6.7 Printed board test characteristics
            6.7.1 Test land pattern spacing
            6.7.2 Test land size and shape
            6.7.3 Design for test parameters
    7 Printed board structure types
       7.1 General considerations
            7.1.1 Categories
            7.1.2 Thermal expansion mismatch
       7.2 Organic base material
       7.3 Non-organic base materials
       7.4 Alternative PB structures
            7.4.1 Supporting-plane PB structures
            7.4.2 High-density PB technology
            7.4.3 Discrete-wire interconnect
            7.4.4 Constraining core structures
            7.4.5 Porcelainized metal (metal core) structures
    8 Assembly considerations for surface-mount technology (SMT)
       8.1 SMT assembly process sequence
       8.2 Substrate preparation
            8.2.1 Adhesive application
            8.2.2 Conductive adhesive
            8.2.3 Solder paste application
            8.2.4 Solder preforms
       8.3 Component placement
            8.3.1 Component data transfer
       8.4 Soldering processes
            8.4.1 Wave soldering
            8.4.2 Vapour-phase soldering
            8.4.3 IR reflow
            8.4.4 Hot air/gas convection
            8.4.5 Laser reflow soldering
       8.5 Cleaning
       8.6 Repair/rework
            8.6.1 Re-use of removed components
            8.6.2 Heatsink effects
            8.6.3 Dependence on printed board material type
            8.6.4 Dependence on copper land and conductor layout
            8.6.5 Selection of suitable rework equipment
            8.6.6 Dependence on assembly structure and soldering
                  processes
    Annex A (informative) Test patterns - Process evaluations
    Annex B (informative) Abbreviations
    Annex ZA (normative) Normative references to international
                         publications with their corresponding
                         European publications
    Figures
    Tables

    Abstract - (Show below) - (Hide below)

    Gives information on land pattern geometries used for the surface attachment of electronic components.

    General Product Information - (Show below) - (Hide below)

    Development Note Indice de classement: C93-711-5-1. Supersedes NFC 93 71151. (01/2004)
    Document Type Standard
    Publisher Association Francaise de Normalisation
    Status Superseded
    Superseded By
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    NF EN 61191-2 : 2014 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    IEC 61188-1-1:1997 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - GENERIC REQUIREMENTS - FLATNESS CONSIDERATIONS FOR ELECTRONIC ASSEMBLIES
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    IEC 60097:1991 GRID SYSTEM FOR PRINTED CIRCUITS
    NF EN 61191-1 : 2014 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    NF EN 61760-1 : 2014 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    NF EN 61192-2 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    NF EN 61192-1 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
    NF EN 61188 1-1 : 1998 PRINTED BOARD AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 1-1: GENERIC REQUIREMENTS - FLATNESS CONSIDERATIONS FOR ELECTRONIC ASSEMBLIES
    NF EN 60097 : 1994 GRID SYSTEMS FOR PRINTED CIRCUITS
    IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
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