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  • BS EN 61190-1-1:2002

    Current The latest, up-to-date edition.

    Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  16-08-2002

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 Requirements
      4.1 Conflict
      4.2 Flux classification and testing
    5 Quality assurance provisions
      5.1 Responsibility for inspection
      5.2 Classification of inspections
      5.3 Materials inspection
      5.4 Quality inspection
      5.5 Performance inspection
      5.6 Quality conformance
      5.7 Preparation of fluxes for testing
    6 Preparation for delivery
      6.1 Preservation-packing and packaging
    7 Additional information
      7.1 Flux activity
      7.2 Flux and cleaning relationship
      7.3 Ordering data
    Annex A (normative)
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications
    Bibliography
    Figures
    Tables

    Abstract - (Show below) - (Hide below)

    Describes general requirements for the classifications and testing of soldering fluxes for high-quality interconnections in electronics assembly.

    Scope - (Show below) - (Hide below)

    Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Supersedes 98/231473 DC (09/2002)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    ISO 9454-2:1998 Soft soldering fluxes Classification and requirements Part 2: Performance requirements
    EN ISO 9002:1994/AC:1997 QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
    ISO 9002:1994 Quality systems — Model for quality assurance in production, installation and servicing
    EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
    EN ISO 9455-16:2013 Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013)
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    ISO 9455-16:2013 Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    ISO 9001:2015 Quality management systems — Requirements
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    ISO 9000:2015 Quality management systems — Fundamentals and vocabulary
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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