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IEC 61190-1-2 : 3.0
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
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ISO 9454-2 : 1998(R2014)
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SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS |
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EN ISO 9002 : 94 AC 97
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QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION |
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ASTM D 1298 :
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TEST METHOD FOR DENSITY, RELATIVE DENSITY, OR API GRAVITY OF CRUDE PETROLEUM AND LIQUID PETROLEUM PRODUCTS BY HYDROMETER METHOD |
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ISO 9454-1 : 2016
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SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING |
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IEC 61189-6 : 1.0
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES |
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ISO 9002 : 1994
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QUALITY SYSTEMS - MODEL FOR QUALITY ASSURANCE IN PRODUCTION INSTALLATION AND SERVICING |
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EN 61189-3 : 2008
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
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IEC 61189-5 : 1.0
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
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EN ISO 9455-16 : 2013
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SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
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IEC 61189-3 : 2.0
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
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IEC 61191-1 : 2.0
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PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
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ISO 9455-16 : 2013
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SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TESTS, WETTING BALANCE METHOD |
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IEC 60194 : 6.0
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PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS |
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ISO 9001:2015
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QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS |
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IEC 61191-2 : 3.0
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PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
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ISO 9453 : 2014
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SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS |
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IEC 61191-4 : 2.0
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PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
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ISO 9000 : 2015
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QUALITY MANAGEMENT SYSTEMS - FUNDAMENTALS AND VOCABULARY |
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IEC 61189-2 : 2.0
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES |
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IEC 61190-1-3 : 2.1
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
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EN 61189-2 : 2006
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES |
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IEC 61191-3 : 2.0
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PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |