BS EN 165000-1:1996
Current
The latest, up-to-date edition.
Film and hybrid integrated circuits Generic specification. Capability approval procedure
Hardcopy , PDF
English
15-10-1996
1 General
1.1 Scope
1.2 Normative references
1.3 Units, symbols and terminology
1.4 Standard and preferred values
1.5 Marking
2 Quality assessment procedures
2.1 General
2.1.1 Eligibility for capability approval
2.1.2 Primary stage of manufacture
2.1.3 Subcontracting
2.1.4 Control of procurement sources and incoming
material
2.1.5 Validity of release for delivery
2.1.6 Rework
2.2 Procedures for capability approval
2.2.1 Application for capability approval
2.2.2 Granting of capability approval
2.2.3 Description of capability
2.2.4 Capability qualifying components
2.2.5 Demonstration and verification of capability
2.2.6 Procedures to be followed in the event of CQC
failures
2.2.7 Abstract of description of capability
2.3 Procedures following the granting of capability
approval
2.3.1 Maintenance of capability approval
2.3.2 Notification of changes likely to affect the
validity of capability approval
2.4 Release for delivery
2.4.1 General
2.4.2 Quality conformance inspection requirements
2.4.3 Detail specification
2.4.3(1) General
2.4.3(2) Customer detail specification
2.4.3(3) Detail specification for standard catalogue
circuits to be included in the Qualified
Products List (QPL)
3 Test and measurement procedures
3.1 General
3.2 Standard conditions for testing
3.3 Visual inspections and package dimensions
3.4 Electrical measurement procedures
3.5 Environmental test procedures
Figures
1 Definition of axis for mechanical and other tests
2 Pulling force for bond strength test
3 Apparatus requirements for the added component
bond strength destructive test
Prescribes the quality assessment procedures and methods of test to be used for the assessment of hybrid circuits.
Committee |
EPL/47
|
DevelopmentNote |
Reviewed and confirmed by BSI, Feb 2005. (02/2005) Supersedes 94/216398 DC. (09/2005)
|
DocumentType |
Standard
|
Pages |
56
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
Standards | Relationship |
I.S. EN 165000-1:1998 | Identical |
SN EN 165000-1 : 1996 | Identical |
NEN EN 165000-1 : 1996 | Identical |
EN 165000-1:1996 | Identical |
DIN EN 165000-1:1996-11 | Identical |
BS EN 165000-4:1996 | Film and hybrid integrated circuits Customer information, product assessment level schedules and blank detail specification |
BS EN 165000-5:1998 | Film and hybrid integrated circuits Procedure for qualification approval |
BS 9450:1998 | Specification for integrated electronic circuits and micro-assemblies of assessed quality (capability approval procedures). Generic data and methods of test |
BS EN 165000-3:1996 | Film and hybrid integrated circuits Self-audit checklist and report for film and hybrid integrated circuit manufacturers |
BS EN 165000-2:1996 | Film and hybrid integrated circuits Internal visual inspection and special tests |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
IEC 60134:1961 | Rating systems for electronic tubes and valves and analogous semiconductor devices |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
EN 100012 : 1995 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: X-RAY INSPECTION OF ELECTRONIC COMPONENTS |
IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
IEC 60068-2-11:1981 | Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist |
CECC 00114 : 93 AMD 1 | QUALITY ASSESSMENT PROCEDURES - APPROVAL OF MANUFACTURERS AND OTHER ORGANIZATIONS |
IEC 60068-2-47:2005 | Environmental testing - Part 2-47: Test - Mounting of specimens for vibration, impact and similar dynamic tests |
IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
IEC TR 60440:1973 | Method of measurement of non-linearity in resistors |
IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
CECC 00016 : 1990 | BASIC SPECIFICATION - BASIC REQUIREMENTS FOR THE USE OF STATISTICAL PROCESS CONTROL (SPC) IN THE CECC SYSTEM |
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
IEC 60748-1:2002 | Semiconductor devices - Integrated circuits - Part 1: General |
CECC 00300 : 1996 | REGISTER OF CECC SPECIFICATIONS |
IEC 60068-2-28:1990 | Environmental testing - Part 2: Tests. Guidance for damp heat tests |
IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
IEC 60068-2-44:1995 | Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
CECC 00007 : 1978 | BASIC SPECIFICATION: SAMPLING PLANS AND PROCEDURES FOR INSPECTION BY ATTRIBUTES |
CECC 00400 : 86 ERRATUM 92 | HANDBOOK FOR THE PRODUCTION OF CECC DOCUMENTS |
IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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