BS EN 61249-8-8:1997
Current
Current
The latest, up-to-date edition.
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
15-12-1997
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.Gives requirements for qualification of temporary solder resist coatings, known as masks as they are easily removable. Peelable solder masks are for screen printing to areas of a completed printed board or panel before shipment, so as to protect areas of the board or panel during processes by the board assembler. Mainly used for protection of keypad contacts during fluxing and mass soldering.
| Committee |
EPL/501
|
| DevelopmentNote |
Also numbered as IEC 61249-8-8 Supersedes 94/211487 DC (11/2005)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| I.S. EN 61249-8-8:1999 | Identical |
| SN EN 61249-8-8 : 1997 | Identical |
| DIN EN 61249-8-8:1998-01 | Identical |
| UNE-EN 61249-8-8:2000 | Identical |
| EN 61249-8-8:1997 | Identical |
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| IEC 61252:1993+AMD1:2000+AMD2:2017 CSV | Electroacoustics - Specifications for personal sound exposure meters |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60993:1989 | Electrolyte for vented nickel-cadmium cells |
| IEC 60695-2-1:1991 | Fire hazard testing - Part 2: Test methods - Section 1: Glow-wire test and guidance |
| IEC 60250:1969 | Recommended methods for the determination of the permittivity and dielectric dissipation factor of electrical insulating materials at power, audio and radio frequencies including metre wavelengths |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 62326-4-1:1997 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C |
| IEC 60243:1967 | Recommended methods of test for electric strength of solid insulating materials at power frequencies |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| BS EN 60068-2-30:2005 | Environmental testing Tests. Test Db and guidance: Damp heat, cyclic (12 h + 12 h cycle) |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| ISO 62:2008 | Plastics Determination of water absorption |
| IEC 60426:2007 | Electrical insulating materials - Determination of electrolytic corrosion caused by insulating materials - Test methods |
| IEC 62326-4-1:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C |
| EN 61189-1 : 97 AMD 1 2001 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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