![header thumbnail](/images/publishers\bsi_cover.gif)
BS EN 62258-1:2010
Current
The latest, up-to-date edition.
![header thumbnail](/images/publishers\bsi_cover.gif)
Semiconductor die products Procurement and use
Hardcopy , PDF
English
30-11-2010
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Data exchange
6 Requirements for all devices
7 Requirements for bare die and wafers with or without
connection structures
8 Minimally-packaged devices
9 Quality, test and reliability
10 Handling and packing
11 Storage
12 Assembly
Annex A (informative) - Terminology
Annex B (informative) - Acronyms
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Bibliography
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.