BS IEC 61189-5-2 : 2015
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
Hardcopy , PDF
30-04-2015
English
01-01-2015
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
4 C: Chemical test methods
5 X: Miscellaneous test methods
Bibliography
Specifies test methods for soldering flux based on the existing IEC 61189-5 and IEC 61189-6.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 12/30274796 DC. (01/2015) Renumbered and superseded by BS EN 61189-5-2. (04/2015)
|
| DocumentType |
Standard
|
| Pages |
44
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| ISO 9455-2:1993 | Soft soldering fluxes — Test methods — Part 2: Determination of non-volatile matter, ebulliometric method |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| IEC 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
| IEC 62137:2004 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| ISO 9455-1:1990 | Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| ISO 5725-2:1994 | Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method |
| ISO 9001:2015 | Quality management systems — Requirements |
| ASTM E 104 : 2002 | Standard Practice for Maintaining Constant Relative Humidity by Means of Aqueous Solutions |
| IPC 9201 : A | SURFACE INSULATION RESISTANCE HANDBOOK |
| LLL-R-626 Revision D:1984 | ROSINS: GUM, WOOD, AND TALL OIL |
| IPC TR 467 : 0 | SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES) |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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