CEI EN 60068-2-58 : 2016
Current
The latest, up-to-date edition.
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
Hardcopy , PDF
English
01-01-2016
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Grouping of soldering processes and related test
severities
5 Test equipment
6 Test Td[1]: Solderability of terminations
7 Test Td[2]: Resistance to soldering heat
8 Test Td[3]: Dewetting and resistance to dissolution of
metallization
9 Final measurements
10 Information to be given in the relevant specification
Annex A (normative) - Criteria for visual examination
Annex B (informative) - Guidance
Annex C (normative) - Application of the test methods to
through hole reflow soldering components (THR)
Annex X (informative) - Cross reference for references
to the prior revision of this specification
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Specifies procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
| Committee |
CT 309
|
| DevelopmentNote |
Supersedes CEI 50-8/5 (02/2003) Classificazione CEI 91-26. (09/2005) 2ED 2005 Edition remains current and will be withdrawn on 01/05/2018. (02/2016)
|
| DocumentType |
Standard
|
| Pages |
44
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Identical |
| EN 60068-2-58:2015/A1:2018 | Identical |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| ISO 9454-2:1998 | Soft soldering fluxes Classification and requirements Part 2: Performance requirements |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| EN 61249-2-35:2009 | Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly |
| EN ISO 9454-2:2000 | Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998) |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| EN 61249-2-22:2005 | Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61249-2-35:2008 | Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 61249-2-22:2005 | Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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