IEC 60068-1:2013
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Environmental testing - Part 1: General and guidance
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IEC 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
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EN 60068-2-20:2008
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
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IEC 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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EN 61190-1-1:2002
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Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
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ISO 9454-2:1998
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Soft soldering fluxes Classification and requirements Part 2: Performance requirements
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EN 60068-1:2014
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Environmental testing - Part 1: General and guidance
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EN 61760-1:2006
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SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
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IEC 61760-1:2006
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Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
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EN 61249-2-35:2009
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Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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EN ISO 9454-2:2000
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Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
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EN 61191-2:2017
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Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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EN 61249-2-22:2005
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Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
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IEC 61190-1-1:2002
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Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
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IEC 60194:2015
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Printed board design, manufacture and assembly - Terms and definitions
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IEC 61249-2-35:2008
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Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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IEC 61191-2:2017
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Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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IEC 61249-2-22:2005
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Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
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EN 61190-1-3:2007/A1:2010
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
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EN 61190-1-2:2014
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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EN 60194:2006
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Printed board design, manufacture and assembly - Terms and definitions
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IEC 61190-1-3:2007+AMD1:2010 CSV
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Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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