CEI EN 61760-3 : 2010
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
Hardcopy , PDF
11-11-2021
English
01-01-2010
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1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements to component design and component specifications
5 Specification of assembly process conditions
6 Typical process conditions
7 Requirements for components and component specifications
for THR soldering processes
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Defines a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 309-19. (12/2010)
|
| DocumentType |
Standard
|
| Pages |
48
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC 61760-3:2010 | Identical |
| EN 61760-3:2010 | Identical |
| IEC 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| EN 60286-5:2004/A1:2009 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 62090:2017 | Product package labels for electronic components using bar code and two-dimensional symbologies |
| CEI 40-10 : 2ED 1998 | IMBALLAGGIO DI COMPONENTI PER OPERAZIONI AUTOMATIZZATE - PARTE 3: IMBALLAGGIO DI COMPONENTI SENZA REOFORI SU NASTRI CONTINUI |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| EN 62090:2017 | Product package labels for electronic components using bar code and two- dimensional symbologies |
| IEC 60286-5:2003+AMD1:2009 CSV | Packaging of components for automatic handling - Part 5: Matrixtrays |
| IEC 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| EN 60286-3:2013/AC:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013) |
| ISO 8601:2004 | Data elements and interchange formats Information interchange Representation of dates and times |
| IEC 60068-2-77:1999 | Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60062:2016 | Marking codes for resistors and capacitors |
| EN 60062:2016/AC:2016-12 | MARKING CODES FOR RESISTORS AND CAPACITORS (IEC 60062:2016/COR1:2016) |
| EN 60068-2-77:1999 | Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock |
| EN 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| EN 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60286-3:2013 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
| EN 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
| IEC 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
| EN 60068-2-45:1992/A1:1993 | Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
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