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CENELEC
EN 60068-2-83 : 2011

EN 60068-2-83 : 2011

Current

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The latest, up-to-date edition.

ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011)

Published date

14-10-2011

Publisher

European Committee for Standards - Electrical

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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Preconditioning
6 Preparation
7 Quick heating method
8 Synchronous method
9 Temperature profile method
Annex A (normative) - Equipment for the quick
        heating and synchronous method
Annex B (informative) - Reading of the output
        data and correction of the result in the
        quick heating test
Annex C (normative) - Test equipment for the
        temperature profile method
Annex D (informative) - Reading of the output
        data and correction of the result in the
        temperature profile test
Annex E (informative) - Caveats/Notes
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Gives methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes.

Committee
SR 91
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

EN 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
CEI EN 60068-3-13 : 1ED 2017 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
BS EN 60068-3-13:2016 Environmental testing Supporting documentation and guidance on Test T. Soldering
I.S. EN 60068-3-13:2016 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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