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EN 60749-6:2017

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature

Published date

16-06-2017

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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Summary
Bibliography

IEC 60749-6:2017(E) is to test and determine the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied. This test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure methods and time-to-failure of solid state electronic devices, including non-volatile memory devices (data-retention failure mechanisms). This test is considered non-destructive but should preferably be used for device qualification. If such devices are used for delivery, the effects of this highly accelerated stress test will need to be evaluated. Thermally activated failure mechanisms are modelled using the Arrhenius equation for acceleration, and guidance on the selection of test temperatures and durations can be found in IEC 60749-43.This edition includes the following significant technical changes with respect to the previous edition:a) additional test conditions;b) clarification of the applicability of test conditions.

Committee
CLC/TC 47X
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

BS EN 62149-2:2014 Fibre optic active components and devices. Performance standards 850 nm discrete vertical cavity surface emitting laser devices
BS EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans
I.S. EN 62572-3:2016 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
CEI EN 60747-15 : 2012 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES
I.S. EN 60749-43:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
EN 62149-8:2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices
I.S. EN 60747-15:2012 SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV))
EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
BS EN 62149-8:2014 Fibre optic active components and devices. Performance standards Seeded reflective semiconductor optical amplifier devices
BS EN 60747-15:2012 Semiconductor devices. Discrete devices Isolated power semiconductor devices
BS EN 62572-3:2016 Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication
CEI EN 60749-43 : 1ED 2018 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
I.S. EN 62149-2:2014 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 2: 850 NM DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER DEVICES
I.S. EN 62149-8:2014 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 8: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER DEVICES
EN 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
EN 62149-2:2014 Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans

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