EN 60749-6:2017
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
16-06-2017
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Summary
Bibliography
IEC 60749-6:2017(E) is to test and determine the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied. This test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure methods and time-to-failure of solid state electronic devices, including non-volatile memory devices (data-retention failure mechanisms). This test is considered non-destructive but should preferably be used for device qualification. If such devices are used for delivery, the effects of this highly accelerated stress test will need to be evaluated. Thermally activated failure mechanisms are modelled using the Arrhenius equation for acceleration, and guidance on the selection of test temperatures and durations can be found in IEC 60749-43.This edition includes the following significant technical changes with respect to the previous edition:a) additional test conditions;b) clarification of the applicability of test conditions.
Committee |
CLC/TC 47X
|
DocumentType |
Standard
|
PublisherName |
European Committee for Standards - Electrical
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Status |
Current
|
Standards | Relationship |
I.S. EN 60749-6:2017 | Identical |
NBN EN 60749-6 : 2003 | Identical |
BS EN 60749-6:2002 | Identical |
UNE-EN 60749-6:2017 | Identical |
NF EN 60749-6:2017 | Identical |
PN EN 60749-6 : 2017 | Identical |
UNE-EN 60749-6:2003 | Identical |
NEN EN IEC 60749-6 : 2017 | Identical |
IEC 60749-6:2017 | Identical |
NF EN 60749-6 : 2002 | Identical |
CEI EN 60749-6 : 2004 | Identical |
DIN EN 60749-6:2016-09 (Draft) | Identical |
BS EN 60749-6:2017 | Identical |
PNE-prEN 60749-6:2016 | Identical |
BS EN 62149-2:2014 | Fibre optic active components and devices. Performance standards 850 nm discrete vertical cavity surface emitting laser devices |
BS EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans |
I.S. EN 62572-3:2016 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
CEI EN 60747-15 : 2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
I.S. EN 60749-43:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
EN 60747-15:2012 | Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
EN 62149-8:2014 | Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices |
I.S. EN 60747-15:2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV)) |
EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
BS EN 62149-8:2014 | Fibre optic active components and devices. Performance standards Seeded reflective semiconductor optical amplifier devices |
BS EN 60747-15:2012 | Semiconductor devices. Discrete devices Isolated power semiconductor devices |
BS EN 62572-3:2016 | Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication |
CEI EN 60749-43 : 1ED 2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
I.S. EN 62149-2:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 2: 850 NM DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER DEVICES |
I.S. EN 62149-8:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 8: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER DEVICES |
EN 62572-3:2016 | Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication |
EN 62149-2:2014 | Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices |
IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
IEC 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
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