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EN 60749-8:2003

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Published date

20-06-2003

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FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 General terms
   3.1 Units of pressure
   3.2 Standard leak rate
   3.3 Measured leak rate
   3.4 Equivalent standard leak rate
4 Bomb pressure test
5 Fine leak detection: radioactive krypton method
   5.1 Object
   5.2 General description
   5.3 Personnel precautions
   5.4 Procedure
   5.5 Specified conditions
   5.6 Gross leak detection
6 Fine leak detection: tracer gas (helium) method
   with mass spectrometer
   6.1 General
   6.2 Method 1: specimens not filled with helium
       during manufacture - Fixed method
   6.3 Method 2: specimens not filled with helium
       during manufacture - Flexible method
   6.4 Method 3: specimens filled with helium
       during manufacture
   6.5 Gross leak detection
7 Gross leaks, perfluorocarbon - bubble detection
   method
   7.1 Object
   7.2 General description
   7.3 Test apparatus
   7.4 Test method
   7.5 Reject criterion
8 Gross leak - Perfluorocarbon - bubble detection
   method
9 Test condition E, weight-gain gross-leak detection
   9.1 Object
   9.2 Equipment
   9.3 Procedure
   9.4 Failure criteria
10 Penetrant dye gross leak detection
11 Gross leak re-test

Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices.

Committee
CLC/TC 47X
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

I.S. EN 62572-3:2016 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
BS EN 60749-14:2003 Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
I.S. EN 60749-14:2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
BS EN 62572-3:2016 Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication
CEI EN 60749-14 : 2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
EN 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
EN 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

EN 60068-2-17:1994 Environmental testing - Part 2: Tests - Test Q: Sealing
IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing

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