EN 61189-1 : 97 AMD 1 2001
Current
The latest, up-to-date edition.
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
30-10-2001
FOREWORD
INTRODUCTION
1 Scope and object
2 Normative reference
3 Accuracy, precision and resolution
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
9 M: Mechanical test methods
10 E: Electrical test methods
11 N: Environmental test methods
12 X: Miscellaneous test methods
Annex A - Worked examples
Annex B - Conversion table
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Contains test methods giving methodologies and procedures for application to test materials used in the manufacture of interconnection structures (printed boards) and assemblies.
| Committee |
SR 91
|
| DocumentType |
Test Method
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61189-1:1997+AMD1:2001 CSV | Identical |
| NBN EN 61189-1 : 1998 | Identical |
| NF EN 61189-1 : 98 AMD 1 2002 | Identical |
| NEN EN IEC 61189-1 : 1997 AMD 1 2001 | Identical |
| I.S. EN 61189-1:1999 | Identical |
| PN EN 61189-1 : 2004 | Identical |
| SN EN 61189-1 : 1997 | Identical |
| UNE-EN 61189-1:1997/A1:2001 | Identical |
| BS EN 61189-1:1997 | Identical |
| DIN EN 61189-1:2002-04 | Identical |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
| EN 62878-1-1:2015 | Device embedded substrate - Part 1-1: Generic specification - Test methods |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| NF EN 61249 8-8 : 1998 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS |
| BS EN 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies Test methods for materials used in manufacturing electronic assemblies |
| I.S. EN 61189-5:2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| I.S. EN 61189-3:2008 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
| I.S. EN 61249-8-8:1999 | MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER |
| BS EN 61249-8-8:1997 | Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings |
| BS EN 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies |
| BS EN 62878-1-1:2015 | Device embedded substrate Generic specification. Test methods |
| I.S. EN 61189-6:2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES |
| BS EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards) |
| EN 61249-8-8:1997 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| EN 61189-5 : 2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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