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CENELEC
EN 61249-8-8:1997

EN 61249-8-8:1997

Current

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The latest, up-to-date edition.

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

Published date

08-08-1997

Publisher

European Committee for Standards - Electrical

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Foreword
1 Scope
2 Normative references
3 Properties
4 Containers and their markings
Annex A (informative) Conversion table
Annex ZA (normative) Normative references to international
                       publications with their corresponding
                       European publications

Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.

Committee
CLC/SR 91
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

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I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
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IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
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IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
EN 61189-1 : 97 AMD 1 2001 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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