I.S. EN 60749-43:2017
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
Hardcopy , PDF
English
01-01-2017
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Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Product categories and applications
5 Failure
6 Reliability test
7 Stress test methods
8 Supplementary tests
9 Summary table of assumptions
10 Summary
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Provides guidelines for reliability qualification plans of semiconductor integrated circuit products (ICs).
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
88
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 60749-43:2017 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60749-28:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level |
| EN 60749-23:2004/A1:2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 23: HIGH TEMPERATURE OPERATING LIFE |
| EN 60749-15:2010/AC:2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
| IEC 60749-21:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| IEC 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
| IEC 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
| IEC 60749-29:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test |
| EN 60749-42:2014 | Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage |
| IEC 60749-11:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method |
| EN 60749-29:2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 29: LATCH-UP TEST |
| EN 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
| IECQ 01:2014 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - BASIC RULES |
| EN 60749-21:2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY |
| IEC 60749-15:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
| IEC 60749-26:2013 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| IEC 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
| EN 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
| IEC 60749-42:2014 | Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage |
| EN 60749-26:2014 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| EN 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
| IEC 60749-23:2004+AMD1:2011 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
| EN 60749-28:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level |
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