IEC 60068-2-44:1995
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
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13-05-2016
30-01-1995
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FOREWORD
SECTION 1: GENERAL
1 Scope
2 Normative references
SECTION 2: GENERAL PRINCIPLES
3 Introduction
4 Solderability of components and wettability of their
terminations
5 Place of solderability in environmental testing
6 Solderability tests
7 Wettability tests
8 Explanations of the test conditions
9 Requirements and the statistical character of results
SECTION 3: GUIDE TO THE USE OF THE WETTING BALANCE FOR
SOLDERABILITY TESTING
10 General
11 Characteristics of test apparatus
12 Examples of representative force-time curves
13 Parameters to be measured from the force-time trace
Annex ZA (normative) Other international publications quoted
in this standard with the references of
the relevant European publications
Provides background information and recommendations for writers of specifications containing references to IEC 60068-2-20, IEC 60068-2-54 and IEC 60068-2-58.The contents of the corrigendum of August 1995 have been included in this copy.
| Committee |
TC 91
|
| DevelopmentNote |
Also numbered as BS EN 60068-2.44. (09/2005) Stability Date: 2017. (07/2015)
|
| DocumentType |
Standard
|
| Pages |
46
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| I.S. EN 60068-2-44:1997 | Identical |
| SN EN 60068-2-44 : 1995 | Identical |
| DIN EN 60068-2-44:1996-02 | Identical |
| EN 60068-2-44:1995 | Identical |
| NF EN 60068 2-44 : 1995 | Identical |
| CEI EN 60068-2-44 : 1996 | Identical |
| AS 60068.2.44-2004 | Identical |
| PN EN 60068-2-44 : 2001 | Identical |
| UNE-EN 60068-2-44:1996 | Identical |
| NEN NPR 10068-2-44 : 1995 | Identical |
| UNE 20501-2-44:1981 | Identical |
| 16/30353588 DC : 0 | BS EN 61020-1 ED 3.0 - ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| BS EN 165000-1:1996 | Film and hybrid integrated circuits Generic specification. Capability approval procedure |
| 14/30309696 DC : 0 | BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| EN 50461:2006 | Solar cells - Datasheet information and product data for crystalline silicon solar cells |
| EN 62137:2004/corrigendum:2005 | ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| IEC 62137:2004 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| BS EN 62137:2004 | Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| 05/30134155 DC : DRAFT MAY 2005 | EN 50461 - SOLAR CELLS - DATASHEET INFORMATION AND PRODUCT DATA FOR CRYSTALLINE SILICON SOLAR CELLS |
| BS IEC 60748-23-1:2002 | Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Generic specification |
| UNE-EN 61020-1:2011 | Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
| IEC 60748-23-1:2002 | Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification |
| I.S. EN 60068-2-54:2006 | ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
| IEC 62137-4:2014 | Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices |
| BS 9752:1989 | Blank detail specification for fixed insulated (unshielded) r.f. inductors suitable for surface mounting at the full assessment level |
| 11/30243259 DC : 0 | BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| PD 6521:1988 | Summaries of test methods for environmental testing of electrotechnical products |
| BS EN 60068-2-54:2006 | Environmental testing Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| I.S. EN 165000-1:1998 | FILM AND HYBRID INTEGRATED CIRCUITS - PART 1: GENERIC SPECIFICATION CAPABILITY APPROVAL PROCEDURE |
| CEI EN 60068-2-54 : 2007 | ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
| IEC 60300-3-5:2001 | Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles |
| I.S. EN 61020-1:2009 | ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
| I.S. EN 62137:2005 | ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| IEC 61020-1:2009 | Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| 12/30271778 DC : 0 | BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
| BS EN 62137-4:2014 | Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices |
| 11/30243576 DC : DRAFT FEB 2011 | BS EN 62643-1 - ELECTROSTATIC MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| I.S. EN 62137-4:2014 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
| BS EN 61020-1:2009 | Electromechanical switches for use in electrical and electronic equipment Generic specification |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| BS 2011-4.2:1984 | Environmental testing. Miscellaneous Guidance on the application of the tests of BS 2011 to simulate the effects of storage |
| BS EN 50461:2006 | Solar cells. Datasheet information and product data for crystalline silicon solar cells |
| NF EN 50461 : 2006 | SOLAR CELLS - DATASHEET INFORMATION AND PRODUCT DATA FOR CRYSTALLINE SILICON SOLAR CELLS |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| EN 165000-1:1996 | Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure |
| EN 62137-4:2014/AC:2015 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014) |
| EN 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| EN 61020-1:2009 | Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
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