IEC 60191-6-18:2010
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Hardcopy , PDF
07-01-2010
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Nominal package dimension
6 Symbols and drawings
7 Dimensions
8 Recommended BGA variations
Bibliography
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision.The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
Supersedes IEC PAS 60191-6-18. (01/2010) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60191-6-18 : 2010 | Identical |
| NEN EN IEC 60191-6-18 : 2010 | Identical |
| I.S. EN 60191-6-18:2010 | Identical |
| PN EN 60191-6-18 : 2010 | Identical |
| BS EN 60191-6-18:2010 | Identical |
| CEI EN 60191-6-18 : 2011 | Identical |
| EN 60191-6-18:2010 | Identical |
| DIN EN 60191-6-18:2010-08 | Identical |
| UNE-EN 60191-6-18:2010 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60191-6-5:2001 | Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) |
| IEC 60191-6-2:2001 | Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
| IEC 60191-6-4:2003 | Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) |
Access your standards online with a subscription
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.
Important note : Users cannot be edited or removed once added to your Multi user PDF.