IEC 60747-14-1:2010
Current
The latest, up-to-date edition.
Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
21-01-2010
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FOREWORD
1 Scope
2 Normative references
3 Terminology, units, letter symbols, terms and
definitions
4 Standard environmental conditions
5 Marking
6 Quality assessment procedures
7 Test and measurement procedures
Annex A (normative) - Sampling procedures
Bibliography
IEC 60747-14-1:2009 describes general items concerning the specifications for sensors, which are the basis for specifications given in other parts of this series for various types of sensors. Sensors described in this standard are basically made of semiconductor materials, however, the statements made in this standard are also applicable to sensors using materials other than semiconductor, for example dielectric and ferroelectric materials. The major changes with regard to the previous edition are as follows: a) Title change from "Semiconductor sensors - General and classification" to "Semiconductor sensors - Generic specification for sensors"; b) Clause 3 has been divided into three Clauses 3, 4 and 5; c) Added new terms from IEC 60747-14-5; d) Added a new Clause relating to Quality assessment procedures; e) Added a Bibliography; f) Added a new Annex for the sampling procedure.
| Committee |
TC 47/SC 47E
|
| DevelopmentNote |
Stability Date: 2017. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| BS IEC 60747-14.1 : 2010 | Identical |
| NEN IEC 60747-14-1 : 2010 | Identical |
| BS IEC 60747-14-1:2010 | Identical |
| PN IEC 60747-14-1 : 2003 | Identical |
| CEI EN 62047-9 : 2012 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS |
| 13/30264591 DC : 0 | BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
| 17/30355780 DC : DRAFT SEP 2017 | BS EN 60747-18-2 - SEMICONDUCTOR DEVICES - PART 18-2: SEMICONDUCTOR BIO SENSORS - EVALUATION PROCESS OF LENS-FREE CMOS PHOTONIC ARRAY SENSOR PACKAGE MODULE |
| 07/30172404 DC : DRAFT DEC 2007 | BS EN 62047-9 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS |
| BS IEC 60747-14-5:2010 | Semiconductor devices Semiconductor sensors. PN-junction semiconductor temperature sensor |
| BS ISO 19614:2017 | Traditional Chinese medicine. Pulse graph force transducer |
| 16/30301330 DC : 0 | BS ISO 19614 - TRADITIONAL CHINESE MEDICINE - PULSE GRAPH FORCE TRANSDUCER |
| BS EN 62047-9:2011 | Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS |
| IEC 60747-14-3:2009 | Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors |
| ISO 19614:2017 | Traditional Chinese medicine — Pulse graph force transducer |
| ISO 23552-1:2007 | Safety and control devices for gas and/or oil burners and gas and/or oil appliances — Particular requirements — Part 1: Fuel/air ratio controls, electronic type |
| BS IEC 60747-14.3 : 2009 | SEMICONDUCTOR DEVICES - PART 14-3: SEMICONDUCTOR SENSORS - PRESSURE SENSORS |
| IEC 60747-14-5:2010 | Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor |
| I.S. EN 62047-9:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS |
| 07/30164953 DC : 0 | IEC 60747-14-5 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 14-5: SEMICONDUCTOR SENSORS - PN-JUNCTION SEMICONDUCTOR TEMPERATURE SENSOR |
| 08/30181404 DC : DRAFT APR 2008 | BS IEC 60747-14-3 - SEMICONDUCTOR DEVICES - PART 14-3: SEMICONDUCTOR SENSORS - PRESSURE SENSORS |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| IEC 62047-9:2011 | Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS |
| EN 62047-9:2011 | Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS |
| IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
| IECQ 001002-3:2005 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| IEC 60721-2-1:2013 | Classification of environmental conditions - Part 2-1: Environmental conditions appearing in nature - Temperature and humidity |
| IEC 62047-1:2016 | Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions |
| IEC 60721-3-0:1984+AMD1:1987 CSV | Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Introduction |
| IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
| IEC 60721-3-1:1997 | Classification of environmental conditions - Part 3 Classification of groups of environmental parameters and their severities - Section 1: Storage |
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