IEC 60749-19:2003+AMD1:2010 CSV
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French
29-11-2010
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Foreword
1 Scope
2 Description of the test apparatus
3 Test method
4 Failure criteria
5 Requirements
6 Categories of separation
7 Summary
IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC 60749. (03/2008) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60749-19 : 2003 AMD 1 2011 | Identical |
| NEN EN IEC 60749-19 : 2003 AMD 1 2010 | Identical |
| I.S. EN 60749-19:2003 | Identical |
| PN EN 60749-19 : 2005 AMD 1 2010 | Identical |
| SN EN 60749-19 : 2003 | Identical |
| EN 60749-19:2003/A1:2010 | Identical |
| DIN EN 60749-19:2011-01 | Identical |
| BS EN 60749-19 : 2003 | Identical |
| CEI EN 62047-9 : 2012 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| BS EN 62047-9:2011 | Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS |
| 13/30264591 DC : 0 | BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| I.S. EN 62047-9:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| IEC 62047-9:2011 | Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS |
| EN 62047-9:2011 | Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.