IEC 60749-3:2017
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French, English
03-03-2017
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Failure criteria
7 Summary
Annex A (informative) - External visual report
form/checklist (example only - not a
mandatory template)
Bibliography
IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62163 (08/2002) Supersedes IEC 60749. (03/2008) Stability Date: 2022. (03/2017)
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-7318-0
|
| Pages |
21
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NEN EN IEC 60749-3 : 2017 | Identical |
| EN 60749-3:2017 | Identical |
| DIN EN 60749-3:2003-04 | Identical |
| PN EN 60749-3 : 2017 | Identical |
| BS EN 60749-3:2002 | Identical |
| CEI EN 60749-3 : 2004 | Identical |
| UNE-EN 60749-3:2017 | Identical |
| PNE-prEN 60749-3:2016 | Identical |
| NF EN 60749-3 : 2002 | Identical |
| BS EN 60749-3:2017 | Identical |
| SAC GB/T 4937-3 : 2012 | Identical |
| UNE-EN 60749-3:2003 | Identical |
| 13/30264591 DC : 0 | BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
| I.S. EN 60749-34:2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
| BS EN 60749-34:2010 | Semiconductor devices. Mechanical and climatic test methods Power cycling |
| IEC 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
| NF EN 60749-20 : 2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| EN 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| EN 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
| 02/207672 DC : DRAFT JULY 2002 | IEC 60749-34 ED.1 - POWER CYCLING |
| I.S. EN 62435-5:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
| I.S. EN 60749-11:2002 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 11: RAPID CHANGE OF TEMPERATURE - TWO-FLUID-BATH METHOD |
| 09/30209939 DC : 0 | BS EN 60749-34 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
| CEI EN 60749-34 : 2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| BS EN 60749-11:2002 | Semiconductor devices. Mechanical and climatic test methods Rapid change of temperature. Two-fluid-bath method |
| 07/30168484 DC : 0 | BS EN 60749-20 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| CEI EN 60749-20 : 2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| BS EN 60749-20:2009 | Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| UNE-EN 60749-34:2011 | Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling |
| IEC 60749-11:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method |
| BS EN 62435-5:2017 | Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| CEI EN 60749-11 : 2004 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 11: RAPID CHANGE OF TEMPERATURE - TWO-FLUID-BATH METHOD |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| I.S. EN 60749-20:2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| EN 60749-11:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| IEC 62483:2013 | Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices |
| IEC 60749-9:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking |
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