IEC 62047-8:2011
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French
14-03-2011
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Test piece
6 Test procedure and analysis
7 Test report
Annex A (informative) - Data analysis: Test results by using
nanoindentation apparatus
Annex B (informative) - Test piece fabrication: MEMS process
Annex C (informative) - Effect of misalignment and geometry
on property measurement
Bibliography
IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the conventional tensile test. This testing method is valid for test pieces with a thickness between 50 nm and several mum, and with an aspect ratio (ratio of length to thickness) of more than 300. The hanging strip (or bridge) between two fixed supports are widely adopted in MEMS or micro-machines. It is much easier to fabricate these strips than the conventional tensile test pieces. The test procedures are so simple to be readily automated. This international standard can be utilized as a quality control test for MEMS production since its testing throughput is very high compared to the conventional tensile test.
Committee |
TC 47/SC 47F
|
DevelopmentNote |
Stability Date: 2018. (09/2017)
|
DocumentType |
Standard
|
Pages |
40
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Standards | Relationship |
NF EN 62047-8 : 2011 | Identical |
NBN EN 62047-8 : 2011 | Identical |
NEN EN IEC 62047-8 : 2011 | Identical |
I.S. EN 62047-8:2011 | Identical |
PN EN 62047-8 : 2011 | Identical |
UNE-EN 62047-8:2011 | Identical |
BS EN 62047-8:2011 | Identical |
CEI EN 62047-8 : 2012 | Identical |
EN 62047-8:2011 | Identical |
DIN EN 62047-8:2011-12 | Identical |
PNE-FprEN 62047-8 | Identical |
BS EN 62047-22:2014 | Semiconductor devices. Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates |
CEI EN 62047-10 : 2012 | SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 10: MICRO-PILLAR COMPRESSION TEST FOR MEMS MATERIALS |
17/30352696 DC : DRAFT SEP 2017 | BS IEC 62047-31 ED1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 31: FOUR-POINT BENDING TEST METHOD FOR INTERFACIAL ADHESION ENERGY OF LAYERED MEMS MATERIALS |
10/30211442 DC : 0 | BS EN 62047-10 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICROPILLAR COMPRESSION TEST FOR MEMS MATERIALS |
CEI EN 62047-21 : 2016 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 21: TEST METHOD FOR POISSON'S RATIO OF THIN FILM MEMS MATERIALS |
EN 62047-21:2014 | Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials |
I.S. EN 62047-10:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICRO-PILLAR COMPRESSION TEST FOR MEMS MATERIALS (IEC 62047-10:2011 (EQV)) |
I.S. EN 62047-22:2014 | SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 22: ELECTROMECHANICAL TENSILE TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES |
NF EN 62047-22 : 2014 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 22: ELECTROMECHANICAL TENSILE TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES |
BS EN 62047-10:2011 | Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials |
IEC 62047-29:2017 | Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature |
IEC 62047-21:2014 | Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials |
IEC 62047-10:2011 | Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials |
I.S. EN 62047-21:2014 | SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 21: TEST METHOD FOR POISSON'S RATIO OF THIN FILM MEMS MATERIALS |
BS EN 62047-21:2014 | Semiconductor devices. Micro-electromechanical devices Test method for Poisson\'s ratio of thin film MEMS materials |
EN 62047-22:2014 | Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates |
NF EN 62047-21 : 2014 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 21: TEST METHOD FOR POISSON'S RATIO OF THIN FILM MEMS MATERIALS |
IEC 62047-22:2014 | Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates |
EN 62047-10 : 2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICRO-PILLAR COMPRESSION TEST FOR MEMS MATERIALS (IEC 62047-10:2011) |
IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
IEC 62047-3:2006 | Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing |
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