IPC 1601 : 0
Current
The latest, up-to-date edition.
PRINTED BOARD HANDLING AND STORAGE GUIDELINES
Hardcopy
English
01-06-2016
1 INTRODUCTION
2 APPLICABLE DOCUMENTS
3 PRINTED BOARD FABRICATION AND PACKAGING (HANDLING)
4 PACKAGING, STORAGE, AND SHIPMENT
5 PRINTED BOARD RECEIVING, STORAGE AND ASSEMBLY
APPENDIX A - Example Flowdown of Packaging/Handling
Requirements to a Printed Board Supplier
APPENDIX B - Desiccant Required As a Function of Moisture
Barrier Bag (MBB) Size
Gives suggestions for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards.
| Committee |
D-30
|
| DevelopmentNote |
Included in IPC C 105 & IPC C 1000. (09/2010) 2010 Edition is available in Chinese & German languages, See separate records. (07/2016) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| ISBN |
978-1-61193-249-2
|
| Pages |
28
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC 7801 : 0 | REFLOW OVEN PROCESS CONTROL STANDARD |
| EN 62435-1:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General |
| IPC 4554 CHINESE : - | SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| IPC A 610 DANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 003 CHINESE : B | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC A 610 FRENCH : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC A 610 CHINESE : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 4556 : 0 | SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IPC 9631 : 0 | USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION |
| NASA JSC 66491 : 2013 | STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP) |
| IPC 4554 : 0 | SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
| I.S. EN 62435-1:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
| BS EN 62435-1:2017 | Electronic components. Long-term storage of electronic semiconductor devices General |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
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