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IPC 4202 : A

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS

Available format(s)

Hardcopy

Superseded date

10-03-2022

Superseded by

IPC-4202C:2022

€103.01
Excluding VAT

1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION FOR DELIVERY
6 NOTES

Sets up the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed boards.

Committee
D-10
DevelopmentNote
Supersedes IPC FC 231. (06/2002) Included in IPC C 102 & IPC C 1000. (03/2010) A2010 Edition is still available in Chinese Language, See IPC 4202 CHINESE. B2016 Edition released in March 2017. (04/2017) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
Pages
51
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 2223 CHINESE : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
IPC 4204 CHINESE : A2011 AMD 1 2013 FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
IPC 4412 : B SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS
IPC CH 65 CHINESE : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
IPC 2223 GERMAN : C SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IPC FLXCSP0605-CD : 2005 IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE PACKAGING AND RADIO FREQUENCY IDENTIFICATION
IPC 4412 CHINESE : B SPECIFICATION FOR FINISHED FABRIC WOVEN FROM 'E' GLASS FOR PRINTED BOARDS
IPC FLXCSP0706-CD : 2006 IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIP SCALE PACKAGING
IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards
DSCC 11006 : 0 PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING
IPC 4204 : A FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
I.S. EN 16602-70-12:2016 SPACE PRODUCT ASSURANCE - DESIGN RULES FOR PRINTED CIRCUIT BOARDS
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
IPC 6013 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS

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