IPC 6011 : 0
Current
The latest, up-to-date edition.
GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
Hardcopy
English
01-07-1996
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1.0 SCOPE
1.1 Statement of Scope
1.2 Performance Classes
1.3 Dimensions and Tolerances
1.4 Interpretation
1.5 Contractual Agreements
2.0 APPLICABLE DOCUMENTS
2.1 IPC
2.2 International Standards Organization
3.0 REQUIREMENTS
3.1 General
3.2 Terms and Definitions
3.3 Printed Board Detail Requirements
3.4 Deviations and Waivers
3.5 Order of Precedence
3.6 Qualification Assessment
3.7 Quality Assurance Program
3.8 Material
4.0 QUALITY ASSURANCE PROVISIONS
4.1 Responsibility for Inspection
4.2 Materials Inspection
4.3 Quality Conformance Inspection
4.4 Reliability Test and Evaluation
5.0 PREPARATION FOR DELIVERY
5.1 Packaging
6.0 NOTES
6.1 Statistical Process Control (SPC)
APPENDIX A
Tables
Establishes the general requirements and responsibilities for suppliers and users of printed boards. Describes quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6012.
| DevelopmentNote |
To be used with IPC 6012 through IPC 6018. Supersedes IPC RB 276, IPC SC 320, IPC TC 500, IPC ML 950 and IPC MC 324. Also available in German Language, See IPC 6011 GERMAN. Included in IPC 6010 SERIES, IPC C 102, IPC C 105 & IPC C 1000. (07/2009) Also available in Chinese Language, See IPC 6011 CHINESE. (11/2011)
|
| DocumentType |
Standard
|
| Pages |
6
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC PAS 62214:2001 | Identical |
| IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
| IPC J STD 001 SWEDISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC A 43 : 1995 | TEN-LAYER MULTILAYER ARTWORK |
| IPC J STD 001 RUSSIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 TURKISH : E2010 | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 POLISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 9191 : 0 | GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 4553 : A | SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
| IPC 2524 : 0 | PWB FABRICATION DATA QUALITY RATING SYSTEM |
| IPC 6010 SERIES : LATEST | IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
| IPC P-KD0508 : 2009 | ABILITIES AND GAPS: IMAGE TRANSFER TECHNOLOGIES IN PWB FABRICATION |
| IPC J STD 001 HUNGARIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 4553 CHINESE : A | SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
| IPC HDBK 840 : 0 | SOLDER MASK HANDBOOK |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 4556 : 0 | SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS |
| IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 DANISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| IPC 9199 : 0 | STATISTICAL PROCESS CONTROL (SPC) QUALITY RATING |
| IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| NASA KSC E 165 : 2009 | ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR |
| NASA STD 5005 : 2013 | STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT |
| GEIA TA HB 0009 : 2013 | RELIABILITY PROGRAM HANDBOOK |
| NASA KSC DE 512-SM : 2012 | FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS |
| NASA JSC 27301 : 2009 | MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62293:2001 | Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
| IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
| IPC 9708 : 0 | TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING |
| IPC 9708 CHINESE : - | TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 1710 : A2004 | OEM STANDARD FOR PRINTED BOARD MANUFACTURER'S QUALIFICATION PROFILE (MQP) |
| IPC PC 1990 : 1990 | GENERAL REQUIREMENTS FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| IPC QL 653 : A | Certification of Facilities that Inspect/Test Printed Boards, Components & Materials |
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