IEC PAS 62250:2001
|
Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
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IPC J STD 001 SWEDISH : E
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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
|
IPC 6012 RUSSIAN : C
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QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
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IPC A 43 : 1995
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TEN-LAYER MULTILAYER ARTWORK
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IPC J STD 001 RUSSIAN : E
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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
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IPC J STD 001 TURKISH : E2010
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REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
|
IPC J STD 001 POLISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
|
IPC 9191 : 0
|
GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
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IPC 2221 GERMAN : B
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GENERIC STANDARD ON PRINTED BOARD DESIGN
|
IPC 6012 POLISH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
|
IPC 4553 : A
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SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
|
IPC 2524 : 0
|
PWB FABRICATION DATA QUALITY RATING SYSTEM
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IPC 6010 SERIES : LATEST
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IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
|
IPC P-KD0508 : 2009
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ABILITIES AND GAPS: IMAGE TRANSFER TECHNOLOGIES IN PWB FABRICATION
|
IPC J STD 001 HUNGARIAN : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
|
IPC J STD 001 GERMAN : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
|
IPC 4553 CHINESE : A
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SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
|
IPC HDBK 840 : 0
|
SOLDER MASK HANDBOOK
|
IPC 6012 FRENCH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
|
IPC 4556 : 0
|
SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS
|
IPC 6013 GERMAN : B
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QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
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IPC J STD 001 ROMANIAN : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
|
IPC J STD 001 DANISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
|
IPC 6018 CHINESE : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
|
IPC 9199 : 0
|
STATISTICAL PROCESS CONTROL (SPC) QUALITY RATING
|
IPC J STD 001 CHINESE : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
|
IPC J STD 001 SPANISH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
|
IPC J STD 001 FRENCH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
|
NASA KSC E 165 : 2009
|
ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR
|
NASA STD 5005 : 2013
|
STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT
|
GEIA TA HB 0009 : 2013
|
RELIABILITY PROGRAM HANDBOOK
|
NASA KSC DE 512-SM : 2012
|
FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS
|
NASA JSC 27301 : 2009
|
MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE
|
IEC TS 62647-22:2013
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
|
IEC PAS 62293:2001
|
Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
|
IEC PAS 62249:2001
|
Qualification and performance specification for flexible printed boards
|
IPC 9708 : 0
|
TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING
|
IPC 9708 CHINESE : -
|
TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING
|
PD IEC/TS 62647-22:2013
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
|
IPC 2221B:2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN
|
IPC 2221 FRENCH : B2012
|
GENERIC STANDARD ON PRINTED BOARD DESIGN
|
IPC 6013 CHINESE : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
|