IPC 9252 : A
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
Superseded date
04-10-2023
Superseded by
Publisher
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1 SCOPE
2 APPLICABLE DOCUMENTS
3 TERMS AND DEFINITIONS
4 TEST METHODOLOGIES
5 TEST PROGRAM GENERATION
6 ELECTRICAL TEST CERTIFICATION AND
TRACEABILITY
APPENDIX A - Other Tests and Considerations
Pertains to assist in selecting the test analyzer, test parameters, test data, and fixturing required to perform electrical test(s) on all unpopulated printed boards.
| DevelopmentNote |
Supersedes IPC ET 652. (12/2001) Included in IPC C 102, IPC C 105 & IPC C 1000. (12/2008) A2008 Edition is still available in Chinese language, See separate record. (09/2016) Also available in Hardcopy format. (01/2018)
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| DocumentType |
Standard
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| PublisherName |
Institute of Printed Circuits
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
| DSCC 11001 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
| DSCC 11004 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER |
| DSCC 11005 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| MIL-PRF-50884 Revision F:2014 | Printed Wiring Board, Flexible or Rigid-Flex, General Specification for |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| MIL P 50884 : E | PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| MIL-PRF-55110 Revision H:2014 | Printed Wiring Board, Rigid, General Specification for |
| MIL-PRF-31032-2 Revision C:2017 | PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING |
| IPC 7092 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS |
| MIL-PRF-31032-1 Revision D:2017 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING |
| MIL-PRF-31032-4 Revision C:2017 | PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING |
| MIL-PRF-31032-6 Revision B:2017 | PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
| MIL-PRF-31032-3 Revision C:2017 | PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING |
| MIL-PRF-31032-5 Revision B:2017 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
| IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC MI 660 : 1984 | INCOMING INSPECTION OF RAW MATERIALS MANUAL |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| DSCC 11002 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
| IPC D 356 : B | BARE SUBSTRATE ELECTRICAL TEST DATA FORMAT |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| DSCC 11003 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC 9703 : 0 | IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| DSCC 10012 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING |
| DSCC 10013 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES |
| DSCC 11006 : 0 | PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING |
| IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| DSCC 10014:2012 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS |
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